Elon Musk has shared the very first update on the Tesla A15 chip, confirming its successful tape out & plans for A16 and Dojo3.
Elon Musk Shares First Pictures of Tesla A15 After Successful Tape Out, The Road Ahead Includes A16 & Dojo3
In the latest update on X, Elon Musk has congratulated the Tesla AI team on the successful tape out of its A15 AI chip. Elon has also shared pictures of the chip, featuring a large primary die in the middle that will handle all of the compute and 12 DRAM modules on the outskirts, offering high capacity and efficiency-optimized bandwidth. The DRAM modules in the picture are from SK hynix, and while the DRAM SKU ID is not readable, we can see the chip was taped out in the 13th week of 2026, which is between 23rd March and 29th March.
A15 is the follow-up to HW4 and will arrive as a next-gen FSD solution for Tesla. In a previous talk, Elon Musk stated that A15 will offer a monumental 40x improvement over the HW4 chip, with 8x raw compute capabilities, 9x memory, and will deliver brand new features. The chip itself is expected to offer close to 2500 TOPS of AI compute, 144 GB of memory per chip, and is designed with the latest transformer engine in mind.
But there's more, Elon Musk has also stated previously that solving A15 was an existential task for Tesla & it will be a very capable AI chip and AI platform. A15 will be offered in multiple configurations, one being a single-SOC that rivals NVIDIA's Hopper, and then a dual-SOC design which rivals Blackwell while costing much less to produce and using way less power. So we can expect some competitive Perf/$ & Perf/W versus NVIDIA's latest AI offerings.
The chip is expected to be manufactured at TSMC and Samsung, with a high-volume production slated for late 2026 or early 2027. Elon has shared plans to move next-gen chip production to the upcoming TeraFab, but its announcement is still pending.
Meanwhile, Elon also confirms that work is already underway on the next-generation Tesla A16 chip and Dojo3. Since Tesla announced a return to form in the chipmaking business, the plans for Dojo3 are back on track. Tesla resumed the plans for the Supercomputer project back in January 2026, and with Terafab operational and developing DRAM, Packaging, and Chips, all under one roof, this goal should not be far away from now.
About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.
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