I have a comment on ARNOOKIE's fix. As a Tech, I fail to see how insulateing an IC from its SilPad is a good idea under ANY circumstances, more likely to do more harm than good. As substitute heatsinks go, aluminum foil is a poor choice, copper is way better. I would be more inclined to try ARNOOKIE's fix if he provided a DARN GOOD reason to uncouple an IC from it's thermal sink.(and I cant think of one GOOD reason)....IF the problem he believes he's solveing is a heat issue, I would replace the current SilPad, add a piece of copper foil the same size, and place another SilPad on top of it to add mass to the sink. But what do I know? Im just a 64 year old Career Technician.
I do actually suggest using aluminium or copper in my video description. If you look through my video comments you will see that many people have had success doing this fix even with the cardboard shim. The only thing I would not suggest is using thermal paste especially any that are conductive. ?