Financial Times
Financial Times 1 year ago
The FT's Christian Davies and Qianer Liu look into why the world’s leading chipmakers are investing billions of dollars into expanding and improving advanced packaging techniques. Experts believe that the growth of advanced packaging could offer an opportunity for second-tier chipmakers and traditional packaging companies to gain a larger share of the $500bn semiconductor market. Read the article in full here: https://www.ft.com/content/19710eda-b...
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Best investment areas to invest in USA in 2024 where you can compete with China due to tarrifs. -Solar cell to double to 50%. - Steel & aluminum 25% -Semiconductors 50% -Medical supplies -Batteries -Critical minerals - Ship-to-shore cranes.
Chips. The first second layer future archeologists will uncover from the Anthropocene mass extinction geological strata after the ash layer.
Because they need to find new reasons to charge increasing prices while they reach the pinnacle of our current technological level. Chips get hot when you pump them full of electricity, we're reaching/have reached temperature limits. Until photonic chips (light based) are feasible for consumers, chip technology will NOT improve, but share holders like to see numbers go up. Prepare for more planned obsolescence.