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1. WO2005106931 - PATTERN TRANSFER METHOD

Publication Number WO/2005/106931
Publication Date 10.11.2005
International Application No. PCT/JP2005/007709
International Filing Date 22.04.2005
Applicants
  • 株式会社ニコン NIKON CORPORATION [JP]/[JP](AllExceptUS)
  • 生形 壽男 IKUGATA, Toshio [JP]/[JP](UsOnly)
  • 宮川 晶子 MIYAKAWA, Akiko [JP]/[JP](UsOnly)
Inventors
  • 生形 壽男 IKUGATA, Toshio
  • 宮川 晶子 MIYAKAWA, Akiko
Agents
  • 永井 冬紀 NAGAI, Fuyuki
Priority Data
2004-13384028.04.2004JP
Publication Language Japanese (ja)
Filing Language Japanese (ja)
Designated States
Title
(EN) PATTERN TRANSFER METHOD
(FR) PROCÉDÉ DE TRANSFERT DE MOTIFS
(JA) 形状転写方法
Abstract
(EN) Disclosed is a pattern transfer method comprising a first step wherein a desired pattern is transferred to a resin layer (30) which is formed on a substrate (10) via a release layer (20); a following second step wherein the pattern having been transferred to the resin layer (30) is then transferred to the substrate (10) and a part of the release layer (20) is exposed; and a following third step wherein the release layer (20) between the substrate (10) and the resin layer (30) is removed by being dissolved through the exposed part.
(FR) Est décrit un procédé de transfert de motifs comprenant une première étape où un motif souhaité est transféré sur une couche de résine (30) qui est formée sur un substrat (10) via une couche antiadhésive (20) ; une deuxième étape suivante où le motif ayant été transféré vers la couche de résine (30) est alors transféré au substrat (10) et une partie de la couche antiadhésive (20) est exposée ; et une troisième étape suivante où la couche antiadhésive (20) entre le substrat (10) et la couche de résine (30) est éliminée par dissolution à travers la partie exposée.
(JA) 　本発明の形状転写方法は、基板（１０）上に剥離層（２０）を介して形成された樹脂層（３０）に所望の形状を転写する第１の工程と、この工程の後、樹脂層（３０）に転写された形状を基板（１０）に転写するとともに剥離層（２０）の一部を露出させる第２の工程と、この工程の後、基板（１０）と樹脂層（３０）との間にある剥離層（２０）を露出した部分から溶解して除去する第３の工程とを含む。
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Latest bibliographic data on file with the International Bureau

The publication of an international application under the Patent Cooperation Treaty in PATENTSCOPE (which constitutes an element of the Gazette) does not imply the expression of any opinion whatsoever on the part of the International Bureau of WIPO concerning the legal status of any country, territory, city or area or of its authorities, or concerning the delimitation of its frontiers or boundaries.

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BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
027Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
027Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
BPERFORMING OPERATIONS; TRANSPORTING
82NANOTECHNOLOGY
YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
10Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
BPERFORMING OPERATIONS; TRANSPORTING
82NANOTECHNOLOGY
YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
40Manufacture or treatment of nanostructures
CCHEMISTRY; METALLURGY
03GLASS; MINERAL OR SLAG WOOL
CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
15Surface treatment of glass, not in the form of fibres or filaments, by etching
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
5Optical elements other than lenses
18Diffraction gratings
1847Manufacturing methods
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
9Apparatus or processes specially adapted for the manufacture ; , installation, removal, maintenance; of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
24Manufacture or joining of vessels, leading-in conductors or bases
241the vessel being for a flat panel display
242Spacers between faceplate and backplate
BPERFORMING OPERATIONS; TRANSPORTING
82NANOTECHNOLOGY
YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
10Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
BPERFORMING OPERATIONS; TRANSPORTING
82NANOTECHNOLOGY
YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
40Manufacture or treatment of nanostructures
CCHEMISTRY; METALLURGY
03GLASS; MINERAL OR SLAG WOOL
CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
15Surface treatment of glass, not in the form of fibres or filaments, by etching
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
5Optical elements other than lenses
18Diffraction gratings
1847Manufacturing methods
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
9Apparatus or processes specially adapted for the manufacture ; , installation, removal, maintenance; of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
24Manufacture or joining of vessels, leading-in conductors or bases
241the vessel being for a flat panel display
242Spacers between faceplate and backplate