Yinchu Zhao

Here offer Micron N48R：QLC HBM MT29F1T08GBLCEN48R3WC1-R Q’ty：300K samsung V5 256Gb. 6k EP3C16F484C6N EP3C5F256C8N  M393A4K40EB3-CWE server 1. H5WRAGESM8W-N8L Qty:8,000/pcs USD650/pcs D/C:Within 2 years L/T:10Weeks HK EXW 2. KHAA84901B-JC17 Qty:10,000pcs USD480/pcs D/C:21+ L/T:12-16Weeks HK EXW The HBM4 war begins! Memory chip stacking is difficult to solve, Hybrid Bonding is the key to breakthrough SK Hynix, a major Korean memory manufacturer, participated in COMPUTEX 2024 for the first time, displaying the latest HBM3E memory and MR-MUF technology (Mass Re-flow Molded Underfill), and revealed that Hybrid bonding will become a very important part of the chip stack. MR-MUF is a process in which semiconductor wafers are attached to circuits and "EMC" (liquid epoxy molding compound) is used to fill the gaps between wafers or between wafers and bumps when stacking the wafers. At present, MR-MUF technology can make chips closer together, improve heat dissipation performance by 10%, improve energy efficiency by 10%, product capacity reaches 36GB, and can be stacked 12 layers.As for competitors such as Samsung and Micron, which use TC-NCF technology (thermal compression with non-conductive film, non-conductive film thermal compression), it is necessary to convert the material into a solid through high temperature and high pressure, then melt it, and then clean it. The total process More than 2-3 steps, MR-MUF can be completed in one go and no further cleaning is required. Compared with NCF, MR-MUF has about twice the thermal conductivity, which has a great impact on process speed and yield. As the number of stacked layers increases, the HBM package thickness is limited to 775 microns (μm). Therefore, memory manufacturers must think about how to stack more layers within a certain height. This is also a big challenge for current packaging technology, and hybrid bonding (Hybrid bonding) is likely to be one of the solutions.stack more than 20 layers (ie no more than 775 microns) through Hybrid bonding technology. According to Korean media reports, HBM4E will be a 16-20-layer product and is expected to debut in 2028. SK Hynix will use 10-nanometer sixth-generation (1c) DRAM in HBM4E for the first time, and the memory capacity is expected to be significantly increased. (Source of the first picture: Science and Technology News).#china #europe #buy #globalbusiness #headhunter #usa #automotive #automotiveindustry #leadership #motivation #kindness #bestadvice #personaldevelopment #linkedin #hiring #careers #help #employment #happiness #jobs #health #global #world #jobchange #process #plasma #Knlowledgestudy #buyer #globalbusiness #Technology #recycle]\\

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Marvell Technology (Nasdaq: MRVL) Q3 FY2024 By Chengtai Hsieh | Equity Research Marvell Technology delivered strong Q3 FY2024 results, driven by exceptional growth in AI and data center revenues, strategic partnerships and innovations in semiconductor technology. A. Key Financials (Q3 FY2024): 1. Revenue: $1.52B (+19% QoQ, +7% YoY), exceeding guidance by 5%. • Data center: $1.1B (+25% QoQ, +98% YoY). •  Non-AI segments (e.g., Enterprise, Consumer, Automotive): Sequential recovery noted. 2. Gross Margin: 60.5% (-10bps YoY). 3. EPS: $0.43 (+43% QoQ, +5% YoY). B. Operational Achievements: 1. AI Leadership: FY25 AI revenue expected to surpass $1.5B, with FY26 projections at $2.5B. 2. Data Center Momentum: Signed a 5-year multi-generational agreement with AWS. • Launched industry-first 3nm optical DSP reducing >20% power consumption. • Delivered PCIe Gen 7 connectivity and 5nm PAM4 DSP shipments. 3. Recovery in Non-AI Markets: Sequential growth across enterprise, carrier, and automotive segments. C. Strategic Focus: 1. Redirected investments toward data center, driving innovations and market share. 2. Addressed a $75B TAM in the data center market with a 20% market share target. 3. Expanded collaboration with AWS for silicon design and EDA in the cloud. D. Outlook and Recommendation: Marvell’s robust AI revenue growth, leadership in data center solutions, and technological advancements solidify its position in the semiconductor market. The AWS partnership and innovations in custom silicon present significant growth opportunities. • Recommendation: Buy. E. Disclaimer: This report is for informational purposes only and does not constitute investment advice. Please consult a financial advisor before making investment decisions. #EquityResearch #Marvell #Semiconductors #AI #DataCenter

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#ByteDance #TikTok #Broadcom #China #US #TSMC 🤝 ByteDance, the parent company of TikTok, is rumored to be collaborating with American chip designer Broadcom to secure a more stable supply of high-end chips! 👀 Moreover, amidst heightened export restrictions, this collaboration is said to be complying with U.S. export control regulations and will be manufactured by TSMC. 💡 Explore more on the rumored collaboration between the two companies here: https://buff.ly/3zeYHYx 🔗

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SK hynix and TSMC to collaborate on HBM4 innovation #SK hynix has signed an MoU with #TSMC for work together on next-generation #HBM, with plans to mass produce #HBM4 #chips from 2026 💡 HBM is a type of high-speed memory that is used in high-performance computing applications. Its high bandwidth and low latency makes it ideal for applications that require rapid data transfer. #Korean #memory specialist SK hynix currently uses a proprietary #technology to make base dies up to HBM3E, but with this MoU it plans to adopt TSMC’s advanced logic process for HBM4’s base die. This will allow additional functionality can be packed into limited space and "enable breakthroughs in memory performance through trilateral collaboration between product design, #foundry, and memory provider." Thanks again to Dennis Dahlgren and Evertiq - Global for the full article with more background and insights via the link below 🙏💡👇 https://lnkd.in/eiZEaSRF #semiconductorindustry #semiconductormanufacturing #innovation #it #ai #taiwan #semiconductors #cloud #computing #computer #dram #ic

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High Bandwidth Memory (#HBM): Ultimate Guide (by AnySilicon.com - Follow Us 4 Daily Semiconductor News & Updates!) HBM presents a significant leap over traditional #memory types. Key features such as astonishing memory bandwidth, reduced power consumption, impressive memory capacity, and swift transfer rates distinguish HBM from its predecessors. Understanding these characteristics is essential for appreciating the impact of this cutting-edge #technology. Embark on a journey through the intricacies of High Bandwidth Memory with this ultimate guide. Discover the evolution of HBM, its vital applications across various industries, the advantages it offers over conventional #DRAM, and the future of memory configurations in the computing world. Welcome to the gateway of knowledge on High Bandwidth Memory. High Bandwidth Memory Market Size was valued at USD 2.8 Billion in 2022. The high bandwidth memory market industry is projected to grow from USD 3.53 Billion in 2023 to USD 22.573 Billion by 2032, exhibiting a compound annual growth rate (CAGR) of 26.10% during the forecast period (2024 – 2032). A very big thank you again to AnySilicon.com - Follow Us 4 Daily Semiconductor News & Updates! for the full "Ultimate Guide" with more background, insights and charts via the link below 💡🙏👇 https://lnkd.in/ecvqTzWX #semiconductorindustry #semiconductors #semiconductor #technology #tech #chip #innovation #southkorea #samsung #skhynix #micron #it

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🤝 Intel is reportedly joining forces with 14 Japanese companies to develop automation tech for “backend” semiconductor processes, including firms such as Omron, Yamaha Motor, Resonac, and Shin-Etsu Polymer. This collaboration has highlighted the efforts by both the US and Japan to reduce geopolitical risks in the semiconductor supply chain. 💰 The alliance, led by Intel Japan’s Managing Director Kunimasa Suzuki, plans to invest hundreds of billions of Japanese Yen in research and development, aiming to demonstrate technological achievements before 2028. 💡 Dive into more details on the Intel’s collaboration and the semiconductor market dynamics in Japan here: https://buff.ly/4bqpYow 🔗 #Intel #Japan #US #Semiconductor

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Marvell Teralynx 10 Switch Enters Production to Meet Surge in AI Cloud Demands Marvell Technology, Inc., a prominent player in data infrastructure semiconductor solutions, has announced that its Marvell® Teralynx® 10 Ethernet switch is now in volume production, with customer deployments already in progress. The Teralynx 10 is a programmable, low-power Ethernet switch with a groundbreaking 51.2 terabits per second (Tbps) throughput and the industry’s lowest latency, designed to support a wide range of workloads including AI training, inference, and general-purpose computing. https://is.gd/zpWhFZ #ai #artificialintelligence #cloudservices #electronics #llm #machinelearning #marvell

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📡 Singapore's Semiconductor Industry News 💽 NXP Semiconductors and Taiwan Semiconductor Manufacturing Company (TSMC) are planning to expand their US$7.8 billion Singapore plant. The expansion aims to increase production capacity and support growing demand for semiconductors. This move is expected to create new job opportunities and boost Singapore's position as a semiconductor hub. The expansion is slated for completion by 2024. This development underscores the growth prospects of the semiconductor industry in Singapore. https://lnkd.in/gGiNjkgf #SemiconductorIndustry #SingaporeEconomy #InvestmentNews #TechNews #BusinessGrowth #EngineeringNews #ElectronicsEngineering #SemiconductorManufacturing #Microelectronics #ChipDesign #ElectronicsIndustry #Innovation #TechnologyAdvancements

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SK hynix: #GDDR7 Mass Production To Start in Q1'2025 Being a major JEDEC #memory standard, GDDR7 is slated to be produced by all three of the Big Three memory #manufacturers. But it seems that not all three vendors will be kicking off mass production at the same time. #SKhynix was at this year's #Computex trade show, showing off their full lineup of memory #technologies – including, of course, GDDR7. SK hynix is the last of the major memory vendor's we've seen promoting their memory, and fittingly, they seem to be the last in terms of their mass production schedule. According to company representatives at the show, the firm will not kick off mass production of their GDDR7 chips until the first quarter of 2025. Thanks again to Anton Shilov and AnandTech for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eEMBgD_N #semiconductorindustry #semiconductors #semiconductor #technology #tech #innovation #ai #semiconductormanufacturing #dram #mobile #it

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💥 SK Hynix has updated its latest timeline regarding HBM4E, the company’s 7th generation high bandwidth memory, implying the intensified DRAM competition of the next generation. Now the memory giant may be on the same page with its competitor, Samsung. 👀 Kim Gwi-wook, head of SK Hynix’s HBM advanced technology, stated that the company’s generation changes of two-year gap has been shortened to one, and is now on track to launch HBM4E by 2026. 💡 Find out more on Trendforce’s insights on HBM progresses of SK Hynix, Samsung and Micron: https://buff.ly/3QOjvvF 🔗 # SKHynix# DRAM #HBM4E

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Hi folks! 🚀 Marvell's new 3 nm PAM4 DSP is revolutionizing data center connectivity for AI-driven workloads. Here’s what makes the Marvell Ara platform stand out: ⚡ 𝗛𝗶𝗴𝗵 𝗕𝗮𝗻𝗱𝘄𝗶𝗱𝘁𝗵: Achieves 1.6 Tbps with eight 200-Gbps electrical and optical lanes. 🔋 𝗘𝗻𝗲𝗿𝗴𝘆 𝗘𝗳𝗳𝗶𝗰𝗶𝗲𝗻𝗰𝘆: Advanced 3-nm process tech reduces power consumption by 20%, perfect for hyperscale AI data centers. 🎯 𝗕𝘂𝗶𝗹𝘁 𝗳𝗼𝗿 𝗔𝗜: PAM4 modulation and robust FEC ensure fast, reliable, and low-latency data transfer. 🛠 𝗦𝗶𝗺𝗽𝗹𝗶𝗳𝗶𝗲𝗱 𝗗𝗲𝘀𝗶𝗴𝗻: Integrated high-swing laser drivers and backward compatibility for seamless deployment. How do you see this tech shaping next-gen data centers? Read the full news below 👇: https://lnkd.in/gbN-tDkP #AI #DataCenters #OpticalNetworking #EmbeddedTech

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NXP Semiconductors and TSMC-backed Vanguard International have announced a joint venture to construct a $7.8 billion wafer chip fabrication facility in Singapore. This collaboration marks a substantial boost for Singapore's ambitions within the tech sector and aligns with the global trend of geographic diversification in chip manufacturing. The new plant will focus on the production of 12-inch wafers for mature chips (130nm to 40nm), catering to critical functions in automotive, industrial, consumer, and mobile products. This development underscores the increasing importance of Southeast Asia as a chip manufacturing hub, driven by factors like cost competitiveness, talent availability and proximity to major Asian markets.

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Marvell is Accelerating Its Expansion In Vietnam Marvell Technology has accelerated the growth of its workforce and presence in Vietnam in the past year since the company announced plans to expand R&D, engineering, and design activities in the country. Marvell committed to 50% growth of its workforce in Vietnam in three years, a target shared by the company during last year’s US-Vietnam Innovation and Investment Summit attended by Marvell CEO Matt Murphy. In just eight months, Marvell is well ahead of its plans having achieved more than 30% growth. Marvell has also expanded its physical footprint in Vietnam with a new location in Da Nang, adding to its offices in Ho Chi Minh City. The new Marvell design center facility in Ho Chi Minh City, which is expected to open within the next year, and other Marvell engineering facilities in Vietnam are focused on high-speed data center optical connectivity, storage, and analog and mixed-signal semiconductor technologies. These are critical to the build-out of accelerated infrastructure to meet the rising performance and power requirements of AI and cloud data centers. 📧 Email: roy.lam@depend-ele.com 📞 Direct Line: 852 2362 9160 📱Mobile / Whatsapp: +852 6345 3850 💎 Visit us online: www.depend-ele.com Please like, command, share, subscribe my channel to get the daily market information, you are welcome to leave command to further discuss 😊 #semiconductormanufacturing #semiconductorindustry #offer #oems #costdown #shortages #distributor #excessstock #excessinventory #consignment #analogdevices #texasinstruments #automotiveelectronics #industrialautomation #iotsolutions #pcbassembly #pcbmanufacturing #opportunity #sourcingandprocurment #engineering #electroniccomponents #automotiveengineering #automotivetechnology #automotiveindustry #automotive #automation #global #sourcing #hongkong #supercomputer #digital #edgecomputing #electronicsmanufacturing #semiconductors #procurement #cybersecurity #machineslearning #hybridcloud #ai #server #computing #artificialintelligence #healthcare #nvidia #tesla #processors #cloudserver #cloudstorage #datacenters #workstations #network #amd #growthmindset #storage #manufacturing #cloudservices #networking #intel #memory #semiconductor #supercomputers #cloud #technology #innvovation #gpu #electronics #cpu #servers #supplychain #iot #leadership #deeplearning #bigdata #cloudcomputing #ems #smartphone #itad #5g #datacanter #Components #Semiconductors #ICs #CPU #MEMORY #SSD #GPU #HDD #MCU #EOL #Inventory #Excess #Slowmoving #Obsolete #Management #semiconductor #testing #qualityassurance

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China's chip capabilities just 3 years behind TSMC, teardown shows: "Although a difference in yield still exists, SMIC's capabilities are approaching a level three years behind TSMC, based purely on performance of the chips that were shipped. HiSilicon's design capabilities have also improved, as shown by its ability to produce chips with comparable performance as TSMC's 5-nm products, despite their wider circuit width." https://lnkd.in/dmAhPpZp #china #semiconductors #technologynews #chinatech #asiatechnews #technology #deeptech #huawei #criticaltechnologies #technews

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⚠️ A rumored meeting between TSMC and NVIDIA has led to tension between the two giants, regarding whether to establish a dedicated CoWoS production line for the valued AI chip client! 💥 TSMC Chairman C.C. Wei recently pointed out that despite strong AI demand, the company has yet to achieve a supply-demand balance and continues to increase production capacity. Now it seems that even NVIDIA is eagerly pursuing more capacity! 💡 Discover more details about the reported meeting here: https://buff.ly/3W89HP2 🔗 #NVIDIA #TSMC #CoWoS

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