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The meticulously designed PA4 series, equipped with a PCIe 4.0 interface, is tailored for challenging automotive and mission-critical applications, prioritizing ruggedization and ample capacity. It comes in versatile M.2 2280, M.2 2242, M.2 2230, E1.S, and U.2 form factors to cater to diverse requirements. Product Specs and Datasheet →
Interface
NAND Flash
Design
Up to
Capacity
Up to
Sustained performance
The PA4 series meets rigorous standards, featuring MIL-STD-810 compliance, conformal coating, and underfill technologies for unparalleled protection against environmental challenges like humidity, shock, and vibration.
Exascend's proprietary technologies enable the PA4 U.2 and E1.S models to achieve less than 7.5W power consumption at 3GB/s and less than 1W at idle – over 50% lower power consumption than other market solutions.
By collaborating with top-tier NAND flash manufacturers and SSD controller creators, we have engineered a bespoke firmware architecture that seamlessly unites advanced hardware and innovative design. This empowers flash storage, providing tailored solutions for success.
Series highlights:
Note: Promotional label not included with product. Actual product labeling may differ from marketing images.
Built to the highest standards, our products boast MIL-STD-810 compliance, conformal coating, and underfill technologies, providing unparalleled protection against humidity, shock, vibration, and environmental factors.
Exascend’s wide temperature technology leverages a unique combination of high-quality components, purpose-designed hardware and highly-optimized firmware to deliver unmatched wide temperature performance and stability.
Our Adaptive Thermal Control™ technology enhances system thermals, airflow, and acoustics, reducing BOM costs. The SuperCruise™ algorithm optimizes write performance, boosting long-term stability and overall reliability.
TCG Opal 2.0-compliant, our self-encrypting drives (SEDs) support AES-256 encryption, BitLocker, and IEEE 1667. Customize with pre-boot authentication (PBA), data sanitization, and Tamper-Proof Firmware for enhanced security.
Leveraging RAID5 at a flash memory block level, our unique RAID ECC recovers severely corrupted data. In sudden power loss, our hardware and firmware power loss protection (PLP) ensures data integrity.
Our control in hardware, firmware and manufacturing allows unmatched power tuning services. Tailoring product performance for your applications achieves optimal performance-to-thermal and performance-to-power ratios.
| Edition | PA4 Series | ||
| Interface | PCIe 4.0 (NVMe 1.4) | ||
| Flash type | 176-layer 3D TLC | ||
| Form factor | M.2 (2280, 2242, 2230) | E1.S | U.2 |
| Capacity | 240GB to 7.68TB | 960GB to 7.68TB | 960GB to 15.36TB |
| Input voltage | 3.3V ±5% | 12V ±10% | |
| Power consumption | Active <8W; Idle <1W | ||
| Sequential read/write up to | 3,200/3,000 MB/s | 3,500/3,000 MB/s | |
| 4K random read/write up to | 400,000/50,000 IOPS | 500,000/55,000 IOPS | |
| Operational temperature | -40°C to 85°C | ||
| Storage temperature | -50°C to 95°C | ||
| Humidity (non-condensing) | 5–95% (Operating) | ||
| Vibration | 10 G (peak, 10–2000 Hz) | ||
| Shock | Operating: 50 G (11 ms duration, half sine wave) Non-operating: 1500 G (0.5 ms duration, half sine wave) | ||
| Features | TCG Opal 2.0. AES-256. Advanced LDPC error correction. Firmware power loss protection. Conformal coating. Underfill. | TCG Opal 2.0. AES-256. Advanced LDPC error correction. Firmware & hardware power loss protection. Conformal coating. Underfill. Hot-plug capable. | |
| TBW up to | 4,800TB | 4,800TB | 9,600TB |
| DWPD (JESD218) | 0.6 @ 3 years | ||
| MTBF | 2,000,000 hours | ||
| Warranty | 3 years | ||
Download datasheet
