2023.0817.b TQC - Plan Phase Exit - Final 8-11-23 - LPR Approved

Jochen HoheiselTributo QC Core Team2023/8/17

Tributo QC Plan Phase Exit

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2

Internal Use -Confidential

Dashboard/TributoRPLTributoQC (CPE)TributoQC (DPE)TributoQC (PPE)Comments

URM798K (24M)TRU: $1747TM%: 14.2%263K (18M)TRU: $1750TM%: 14%263K (18M)TRU: $1820TM%: 14%241K (18M)TRU: $1820TM%: 11.3%

•

Volume decreased by 22k units since DPE`

•

SAPP changes to 10 core, 16GB, new panel and camera at PPE per PLM/PGMKT alignment.

•

TM% reduced to 11.3%, due to changes of SAPP configCarcass Cost at RTS$437.65$488.43$492.67$530.59

•

Gen to Gen Carcass:+$92.94

•

Phase to Phase Carcass: +37.92

•

NRE Box: +$18.41 (removal of Lati, -22ku from DPE),

•

Remaining carcass +$19.51

•

Post DPE adders +$18.86 driven by changes in MB material, FHD cameraand cost of MoneyL10 Transition Cost Delta$1,341.3($4.51)($9.51)($51.37)

•

Gen to Gen-$51.37

•

Phase to Phase:

•

Camera and commodities: +$45.36 (mainly SAPP config change: LCD+$26.67, andcamera +$5.75, Memory +$50.65)

•

OS +$8.58 changes to Home Plus , Other SW -$1.01 (removal McAfee)CPR without Tech Tax$36.05N/A22.94$47.69Schedule RTO3/1/2023Jan 2024Jan 2024Jun/2024

•

Aligned with MS SV23

Quality Goals(IFIR | FIR)1.33 | 16%(FY24 Trib Actuals)N/A14.1%1.84% | 14.1%

•Quality and Engineering are aligned on Goals •

FY25 VoCGoals: 4.5 Stars | 60 pNPS

•

IFIR: Added FY24 for launch phase health indicator Complexity1 PCB, 10 PWAs1 PCB, 5 PWAs1 PCB, 6 PWAs1PCB, 5 PWAsRemoval of 8 core offering

Executive Summary

o

Program Summary: (Tier-1 Program)

•

Tributo

QC is Dell’s next

-generationperformancethin & light

–addressing the large 13” performance

thin & light$1000+ TAM.

o

Program Priority

:

Feature > Schedule > Cost

•

Feature

:

•

Qualcomm NuviaSOC , Qualcomm WiFi7/BT SiPSD1620, Qualcomm AON (Always On) ISP for Vision sensing

•

New LGD 3K tandem pOLEDwith Touch with new A-Cover # of Area of Differentiations (AODs): 4, # of Hero Ecosystem: XPS: 8, # of Hero SW: follow SW MVP

•

Schedule

:

•

RTS Target: 6/14/2024 to align with MS SV23

•

Cost

: Projected cost $1,289.93

•

Potential cost down opportunities: ($7.72) EM390

→

EM370 (trigger 11/18)

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Copyright © Dell Inc. All Rights Reserved.3






Executive Summary: TributoQC PlanPhase Exit

•

Schedule Outlook:

•

Readiness to Phase Exit

•

Functional Key Callout:

SupportAssistwill meet RTS via parallel SW & Platform testing, limited Integration testing and coordination during E2E testing

•

WWP:Identified risk buy items

–

LLT ICs/CPU/WLAN, need to release PO per LT.

•

Process Exceptions:

TR waiver for A cover and thermal module risk go approved at 4/14 and 5/23 (following TributoMTL) .

•

Program Risks

•

Aitosole source risk -Aitobusiness risk in current economic climate (Risk-51)

•

SupportAssistsupport for TributoQC (Risk-148)

•

Dell DiagTool not ready in time to support DVT1 (Risk-135)

•

BIOS Attributes not be available for DVT1 (Risk-136)

•

Manufacturing Modes not available in time (Risk-137)

•

DUP (Dell Update Package) support not available at RTS (Risk-138)

•

Program Key UI:

AI PC branding

–

pending final alignment with MSFT. Parallel paths for Iridescent logo. No budget impact, if decided by 8/22/23.No schedule impact, if decided by 9/22/2023

•

Next Steps:

•

DVT1 pre-build start on 9/20/2023

OLP PhaseConcept EntryConcept ExitDefine ExitPlan ExitRFDRTSRTO

Milestone03/27/202211/17/202202/09/202308/17/20235/17/202406/14/2024Jun/2024

Recommendation: Approve TributoQC PlanPhase Exit

FunctionEngineeringMarketingEDGWWPGOEFinanceServiceQuality

Ready for Exit?YESYESYESYESYESYESYESYES

or

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Backup

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20232024202520262027

JFMAMJJASONDJFMAMJJASONDJFMAMJJASONDJFMAMJJASONDJFMAMJJASOND

XPS Thinking Roadmap

RPL-H MTL-H (6+8)LNL-MxRPL-P MTL M/U/PQC ORYONARL-H

NVIDIA GEN21

NV-ENV-PMTL-H

PTL-HPTL

NVIDIA GENxx

NV-ENV-P

NV REFRESHNV REFRESH

ARL-U / ARL-PQC ORYON V2

NVIDIA GENxx

NV-ENV-P

XPS 15

FIORANO RPLRPL-H45 | RTX4060 (50W TDP)

XPS 14

PISTAMTL-

H45 | NV “X2” (47W TDP)

XPS 16

DIABLOMTL-

H45 | NV “X6” (80W TDP)

XPS 13 2in1

MILLENNIOADL-M9, 5G

XPS 13

PORTOFINOADL-M12

XPS 14

HURACANPTL-Px40 + ORYON V2 UI (40W TDP)

XPS 13

TRIBUTO RQC ORYON (10 & 12c) + MTL-H28

XPS 16

PERFORMANTEIntel | AMD | QC (80W TDP)

QC ORYON V3NOVA LAKE NEXT LAKE

XPS 17

STRADALE RPLRPL-H45 | RTX4070 (90W TDP)

XPS 13 Plus

TRIBUTO RPLRPL-P28 (28W TDP)

XPS 15

FIORANO RPL -ExtensionRPL-H45 | UMA/DG2

XPS 13

DIVOIntel LNL-Mx & ORYON V2 (20W TDP)

PERFORMANTE could move to CY28

or

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D E L L C O N F I D E N T I A L

–

D O N O T C O P Y O R D I S T R I B U T E

Updates / Changes Planned:

✓

Qualcomm Nuvia10C & 12C

✓

New FHD Non-Touch & QHD Touch LCDs with VRR

✓

New LGD 2.8K tandem pOLEDwith Touch with new A-Cover

✓

1080p Camera & 940nm IR

✓

QC WiFi7/BT SiPSD1620

–

no HBS, with DBS

✓

Antenna cable length change for QC 1620 WiFi/BT

✓

New Thermal Solution

✓

Consumer Grade 3+3 Acoustics/Thermals at 17.5W+ with USTT supported

✓

New Camera Logic (but same camera) with QC ISP MIPI

✓

New Memory 4x32bit LP5X (8400MT) up to 64GB

✓

QC AON (Always On) ISP for Vision Sensing

✓

C-Cover CNC modification

✓

A-Cover Alum 75% PIR

✓

Color ALS (on both LCD & OLED hinge-ups)

✓

Qualcomm Fluence AudioNot Supporting:

ꓫ

USB-C Noble Lock

ꓫ

Change to M.2 2280 Storage

ꓫ

Change to FPR

ꓫ

UHD LCD

ꓫ

5G FR1 or FR2

ꓫ

No Advanced Charging

ꓫ

TFR IC Change

XPS 13 “TributoQC”

World’s smallest 13” performance thin & light

XPS laptops are designed to be the best, with leadership form factor, long battery life, best front

of screen, exceptional buildquality and powerful features.

Dell RTS Jun CY24

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Key changes made in Plan Phase…

Leveraging TributoMTL FHDNT & QHDT LCDs & 1080p camera / 940nm IR Changed entry configuration to 10C (removed 8C from scope) and changed

RAM to 16GBRemoved the dongles

–

USB-

A “nano” and Headset –

same as TributoMTLConfirmed POR of current 2 CMFs

–

Graphite & Platinum

–

leveraged with TributoMTLRemoved Latitude from scopeAdjusted RTS/EOL

–

Jun CY24 RTS

–

EOL Q1CY26; 18moKey Open: waiting for exec alignment with MS on Ai keyboard / badge

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XPS 13 “TributoQC” –

Plan Exit Cost

TributoRPL $1341 Carcass $429

Brick Removed ($56.00)

Total ($56.00)

C o r e i 7 / 1 6 / 5 1 2 G B / F H D N T

TributoRPL $1285 Carcass $429

ME/EE Changes:

FPC / A-Part $6.76Thermals $1.72CNC, Sustain $5.98MiscEE/ME $3.68Retimers/VRs $3.58CVF/MidBd($4.94)

Total $16.78QC Tech Tax &Cost of $:

PCB / LL $27.30EE $13.60Cost of $ $4.35

Total $45.25Other:

NRE $12.54Pred. Dec &Pred. Chgto TRPL $26.91

Total $39.45

TributoQC $1290 Carcass $531Budget $1290

$1820 TRU / 11% TM

N u v i a 1 0 C / 1 6 / 5 1 2 G B / F H D N T

Commodities:

FHDNT $22.178400MT RAM $20.05WLAN $6.14Camera $5.65Keyboard $1.93Adapter $1.57Dongles ($6.99)512GB C35 ($15.32)10C Nuvia($131.00)

Total ($96.85)

TributoQC $1114 Carcass $531

Opportunities:

MS $35 OS ($48.76)MS/QS Retail Subsidy ($60.00)Added QC Subsidy ($60.00)LL PCB Conting. ($7.44)

Total $176.20

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Better By Every Measure…

Intuitive & Natural Interactions

•

Full Size, ETE Lattice-less Rubber-Dome Keyboard

•

Piezo Haptics ForcePadunder Seamless Glass Palmrest

•

Capacitive Media Keys

•

Connected Modern Standby

•

Far-Field Voice Recognition with WoV

•

Hello FPR in Powerbuttonwith Payment Capability

•

Qualcomm AON Vision Sensing & Intelligent Collaboration & Hello IR / Dual Lens Camera

•

1080p Camera with 940nm Hello IR with OLED

Leadership Form Factor, Exceptional Build Quality, Unique Materials

•

4-Sided Infinity 16:10 Optimized Form-Factor at 90%+ Display:Body Ratio

•

Target 295 x 199 x 14.8mm Zm& <2.67lbs

•

XPS Industrial Design

–

machined aluminum & glass

Best Front Of Screen Performance

•

Qualcomm 8cx Gen4, SC8380XP, 10c/12c, 20W+ TDP, Next Gen Adreno GPU

•

13.4” 16:10 FHD+ LCD 500nits, 100% sRGB Typical, VRR,

NonTouchAG Infinity Display

•

13.4” 16:10 QHD+ LCD 500nits, 100% DCI

-P3 Typical, HDR 400, VRR, Touch Infinity AR Disp

lay

•

13.4” 16:10 3K

pOLED400nits, 100% DCI-P3 Typical, TrueBlack500, Discrete Touch Infinity AR Display

•

Industry leading Display:Body ratio; narrow bezels

•

PCIex4 NVMeSSD Storage (1xM.2 2280 slot); up to 4TB

•

16-64GB 8400MT LPDDR5X Memory Onboard

•

Qualcomm WiFi7/BT5.3 with DBS (16x20 onboard)

•

Quad Speaker Audio; QC Fluence Audio

•

Thunderbolt4/USB4 (x2)

•

Early Sign of Life; Power-on from S5 with lid open

Long Battery Life

•

20+hrs Battery Life (Netflix Streaming) with Accelerated Charge (55Whr; 800Whr/L)

World’s smallest 13” performance thin & light

XPS laptops are designed to be the best, with leadership form factor, long battery life, best front of screen, exceptional buildquality and powerful features.

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–


TributoRPLTributoQC

Display

13.4” 16:10 FHD+ Non

-Touch AG, 500nits

13.4” 16:10 FHD+ Touch AR, 500nits13.4” 16:10 UHD+ Touch AR, 500nits13.4” 16:10 3.5K OLED Touch AR, 400nitsNEW 13.4” 16:10 FHD+ Non

-Touch AG, 500nits-

NEW 13.4” 16:10 QHD+ Touch AR, 500nitsNEW 13.4” 16:10 2.8K+ OLED Touch AR, 400nits

Architecture RaptorLakeP 4+8+2 & 6+8+2 at 28W Max TDP; Connected Modern StandbyQC Nuvia10c/12c at 25.5W Max TDP; Connected Modern StandbyTarget Dimension& WeightTarget 295 x 199 x 15.2z; 2.7lbs (NonTouch & Touch)Target 295 x 199 x 14.8z; 2.67lbs Bound (New OLED hinge-up)GraphicsIntel RaptorLakeP U28 (17.5W/28W TDP)Qualcomm Nuvia (17.5W/25.5W TDP)Memory8/16/32GB 4x32bit LPDDR5 5200MT16/32/64GB 4x32GB LPDDR5X 8400MT StorageM.2 SATA & NVMe SSD up to 4TB; PCIe x4 Support; Gen3&4M.2 SATA & NVMe SSD up to 4TB; PCIe x4 Support; Gen3&4Camera / SensorsHD Camera & 850nm Hello IR; Intel Vision Sensing & Intelligent Collaboration; ALS FHD camera with 940nm Hello IR; QC Vision Sensing& Intelligent Collaboration; Color ALS Keyboard / C-CoverFullSize Rubber Dome, Backlit, 1.0mm Travel; Non-Clipped; Lattice-less ETE Seamless Haptics ForcePad under ETE palmrest glassHello Compliant FPR in PowerButtonCapacitive Media/FnKeysFullSize Rubber Dome, Backlit, 1.0mm Travel; Non-Clipped; Lattice-less ETE Seamless Haptics ForcePad under ETE palmrest glassHello Compliant FPR in PowerButtonCapacitive Media/FnKeysBattery13hrs Netflix Streaming (55Whr/800Whr)Accelerated Charging to 35% capacity & Express ChargeInstant On; Power on from S5 with lid openTarget 20hrs+ Netflix Streaming (55Whr/800Whr)Accelerated Charging to 35% capacity & Express ChargeInstant On; Power on from S5 with lid openI/OPortsThunderbolt4/USB4 (x2)Thunderbolt4/USB4 (x2)Networking / CommsKiller AX1675 6GHz 802.11ax (12x16 onboard)

–

ConsumerIntel AX211 6GHz 802.11ax (12x16 onboard)

–

CommercialQC 802.11ax (16x20 onboard)

–

Consumer & CommercialAudioGrade B Quad SpeakerFar-Field Cortana (via 2 Digital Array Mics) in hinge upGrade B Quad SpeakerFar-Field Cortana (via 2 Digital Array Mics) in hinge upOperating SystemWin11 FI & CABs; UbuntuWin11 FI & CABsBIOSDell BIOS

–

Full Manageability; vPRO& TAA (Commercial)Dell BIOS

–

Full ManageabilityAC Adapter60W / Type-C60W / Type-C

XPS 13 PlusXPS Plus 13

BLUE = Delta to TributoRPL

TributoRP

L

vs. TributoQC

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XPS 13 “TributoQC” Customer & Market Summary

13” Performance Thin & Light

Thin Light Performance XPS

High Perf/Watt Qualcomm NuviaLong Battery LifeIconic XPS Edge-to-Edge Interfaces

Target LaunchTTM QC NUVIA

–

June CY24 Volume241K Units*; 18mo lifecycle (QC only)SAPP$1199 (NUVIA10C/16GB/512GB/FHDNT)TRU / TM$1820 / 11%

Target Customer:Young Metropolitan

Age 16-35City LivingBrands that reflect values / beliefsInfluence culture & generational trendsAvid social media user

XPS Value Priorities:1.Design

Thin & Light; Infinity DisplayXPS Edge-to-Edge InterfacesNew FHD & QHD LCD with VRRNew 2.8K OLED1080p Camera & 940nm IR

2.Performance

QC Nuvia & 20+hrs Life

3.Cost

Target $1199 SAPP

V a l u e

Price

$800$2000

L o w H i g h

CompetitorConfigurationPriceApple MacAirM2 / 8GB / 256GB$1199Apple MacProM1 / 16GB / 512GB$1999

Target Market Position:

$1199

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Client Program ManagementInternal Use -Confidential


Executive Summary

–

Program Status

FunctionCommentOverall

•

Aligned on SupportAssistplan to support RTS

•

Target RFD on 5/17/2024 & RTS on 6/14/2024

Engineering

•

Eng development is on track

•

Acoustic issue BOM change for capacitors value/size tweak is completed; Qcomkeeps working for SW solution

Marketing

•

BC v 1.0 completed date( MKT please provide)

AQE

•

Quality plan and goals aligned

GOE

•

Operation NUDD and DFMAAidentified with mitigation plan in place

WWP

•

Identified LLT unique parts, some unique ICs/CPU/WLAN, need to do risk buy to meet LT requirement.

Service

•

Service Readiness on track

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Client Program ManagementInternal Use -Confidential


13

Program High Level Schedule

Key MilestonePlanActual

Concept Exit11/17/202311/17/2023Define Phase Exit2/9/20232/9/2023Business Award6/19/20236/20/2023DDS1/16/20231/16/2023Business Contract2/21/20232/21/2023Plan Phase Exit8/17/2023RFD5/17/2024Develop Phase ExitMay 2024FRC6/13/2024RTS6/14/2024RTO6/14/2024

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Mid Plan Phase Deep Dive Actions

➢

All is closed

ItemDescriptionOwnerTarget Close DateActual Close DateClosure ActionsStatus (Open/On-going/Closed)

1Provide details on C-cover CNC change call outEng8/4/20238/1/2023The intend was to highlight that the C-cover is different to previous generation. However it is the same as Tributo MTL and call out not related to 2nd source touchpad enablement.Closed2Use native QC pre-CS4 for ES 2 sample bring up in the factory instead of AG5 for EVT 1.1 and then flash to Dell AG5, but use pre-ES5 for DVT1 bring up - team to plan details and pro / consEng8/11/20231. EVT1.1 SMT on 8/142. BBU in Qcom from 8/22 via QC code (Pre-CS4)3. AGS will support initial version for factory developing on 8/204. Official Pre-CS4 AGS code will be released on 8/30 (2weeks for AGS, 1 week for Compal)5. It will be the baseline of DVT1 build code (Pre-CS4 AGS).Closed3What is the overall impact, if we don't hit FC on 11/30 - reducing 8 weeks from FC to BCO - make sure that critical units and ensure that right quality is delivered to avoid rework, etc.Eng8/11/2023FC on 11/301. HW dependency needs to meet 11/30 as rule.2. HW independency to be aligned based on SW readiness. - ITM condition aligned with GOE to keep DVT2 on-time - Overtime to complete before BCO.Shipping:1. Critical shipment waive items aligned.2. To minimize critical shipment qty3. For 1st shipment, Re-evaluate to add run-in before shipping.Closed4Double click on workshop dates MSFT & QCEng8/4/2023

1. SW alignment

a. Qcom CS SW release on 9/29 and then AGS will take 2 weeks for CS AGS code released on 10/13 aligned w/ ADCb. The worst case is AGS code release delayed, backup plan is to use pre-CS6 for starting pre-work testing.c. 1st WS will use CS AGS code

2. Schedule alignment

a. Pre-work testing will take 3 weeks from 10/16~11/3b. 1st WS in SanDiego from 11/6~11/17

3. Other alignment/ Action

a. Compal pre-work testing includes Qcom test cases and MSFT test cases (Aligned)b. Comapl updated Qcom test L/T and the most items could be covered in 3 weeks testing except USB4 testing in 3rd party. (Aligned)Closed

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Mid Plan Phase Deep Dive Actions

➢

All is closed

ItemDescriptionOwnerTarget Close DateActual Close DateClosure ActionsStatus (Open/On-going/Closed)

5Remove acronyms, e.g. DRMPM8/11/2023Removed acronyms from PPE deckClosed6Reconfirm alignment status on LL 15 & 16 with QCEng8/11/2023Aligned w/ Qcom and AgS as following1. Qcom can have a freeze branch, called CPL (Customer Product Line) for Dell Tributo QC and Thena based on aligned Qcom SW version as lock down2. The timing for creating CPL should be 2~4 weeks before A-can driver (4/8) depends on issue fixing status3. Project SW will be locked down in CPL version until RTS4. After RTS, project SW will switch back to align w/ Qcom/AgS mainlineClosed7Share list of SA features targeted for ARMSW8/11/2023SA (Support Assist) feature list for ARM. in Tributo QC/ Thena

• DTH• DTP• iDiags• Bradbury• Insights – Only for Business PCs (Commercial. Only for Thena)• Remediation – Only for Business PCs (Commercial. Only for Thena)• SRE• CDM – Data migration only applicable for Home PCs (Consumer)• Screenmeet

Closed8Confirm that FW modifications on TP are confirmed by vendor and can support ARMEng8/11/20231. For Aito haptic TP, no different between Tributo QC and Tributo MTL including HW and FW.2. For ELAN tuoch pad, there is a specified CPN for Tributo QC because TP FW different. HW is the same. Now the new FW is working in Tributo QC.Closed

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16

PCR summary

PCR Number Description Status

1012211 Ecosystem matrix v1.4 updateIn BA Scope & implemented1012011 TributoQC/MTL Concave FansNo NRE, MKT approved cost impact - aligned to implement1012052TributoQC Removal of FHDT Panel(complexity approved)no NRE impact, Aligned approved to BA to Sharp for QHD panel.1011068LPDDR5x Qualification rejected as per, the POR is LPDDR5x1012185TributoQC/Tributo QCL RTS Reset approved1012184TributoQC/MTL New FHDNT Panel AddAligned and approved to BA to Sharp for New FHDNT panel1011772Adding QHDTCost is aligned and approved1012538 Add transition 3PP product for current Hero AudioNo NRE driver, aligned to implement.1012737Enabling Microsoft Enhanced Sign-in Security on QTIn BA Scope no additional NRE/Cost/Schedule impact. 1012834 Tributo MTL/QC TFR 2nd source enablement

In BA scope – no NRE impact

1013056 Change of PCB on TributoQC from EM390 to EM370Approved by marketing and implementing1013059 Dolby Atmos for Tributo MTL and QCno schedule and NRE impact1013173 XPS NB keyboard/TFR backlight controlNo NRE drivers and no schedule impact.

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17

XLOB PCRProposed Changes

1011902Taiwan BSMI new CNS standard transition 1011942Morocco allows WiFi 6e certification1007085Factory Reports for Russia1011232China CCC Certifications Transition1011787Azerbaijan allows WiFi 6e certification1010712EAEU Sustaining Replacement and NPI Certs1011793UAE TDRA label must be affixed on the package1011009Add BIOS attribute for camera GPIO detection1011052

2112-01213 – FCC CFR47 Part 15E: UNII-4 Band

1009950

2204-01502 – EU – EN 301 908-1 V15 1 1 – WWAN

1007734

Malaysia – SIRIM Certification Marketing Name

1009803Malaysia and Canada permit WiFi6E Certification1009363

Mexico – IFETEL update the labeling request

1011455PCR Encryption Notification all Platforms 1010468

2205-01558 – Chile – WIFI 6e, Resolución 1321

1009761French CE law Triman marking for Products1011530Australia and New Zealand Permit WiFi6E1011232China CCC Certifications Transition1010712EAEU Sustaining Replacement and NPI Certs1007085Factory Reports for Russia1009587France Triman Logo on Packaging1011115Japan permits WiFi6E Certification1011906EAEU InPerson Factory Inspections: cross ODM factory requirement1010356Adding E2424HS/E2724HS/E2724HN/P2424HT/P3424WE1009916Dell Webcam WB3023 to client ecosystems1012721Proposed Battery Regulation repealing Directive 2006/66/EU and amends Regulation 2019/10201012493SSD 4TB transition from double-side to single-side1013055Rofus AC Adapter Cancellation. Not part of BA1012040Microsoft to deprecate Attestation Signing Service - NRE: $8044

XLOB PCRs covered in BA scope

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Tributo QC Plan Phase-Hero SW Alignment Status

HW/SW NOT aligned w/ no line of sight to closureAlignment at risk w/ mitigations in processAligned w/PF schedule and SW readiness is on trackSW in Ideate/Incubate w/out dates. SW not officially approved.

Summary

(Engineering Assessment)

Tributo QCSupport Assist:

•

SOW issue effects SA integration and dates.

Thena QC N/L

•

For Thena Latitude, instead MyDell by Dell Optimizer.

Hero Software List(HSL)SWOLPPhaseSWFeature CompletePlatform Feature CompleteSWA-RevPlatformA-RevHW / SWAlignmentStatusMyDell (Titan)Define phase11/28/202311/30/20234/18/20244/19/2024-Dell Digital DeliveryDefine phase8/2/202311/30/202311/17/20244/19/2024-Dolby VisionDefine phase11/30/202311/30/20234/18/20244/19/2024-Fluence Qualcomm Audio packageDefine phase11/28/202311/30/20234/18/20244/19/2024Dell Command UpdateDefine phase7/31/202311/30/20231/31/20244/19/2024Dolby AtmosDefinephase11/30/202311/30/20234/19/20244/19/2024UPDDefine phase11/9/202311/30/20234/8/20244/19/2024Support Assist with ProSupport(Bradbury)Define phase1/12/202411/30/20234/19/2024DDRE Lite (OTB for Recovery)Define phase11/30/202311/30/20234/19/20244/19/2024

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SupportAssist -Alignment to Tributo QC \Thena NLV Launch Recovery Plan

PlanRisk/IssuesNext Steps

•

Procure SOW signage by 8/18.

–

signed on 8/15.

•

Enact parallel testing between Platform and SA E2E cross-functional teams once the builds are integrated

•

Ensure appropriate coordination of platform, SA, SW sub

–

components to ensure issue disposition and overall efforts are effective.

•

Resource enablement: Onboarding 8 resources -checkpoint by the end of Sep.

•

Possible high issue count: The recovery plan may have larger number of PIMS reported as SA E2E testing will not complete until 2/20/24.

•

Systemic partner risks: New MSFT OS and QC chipset. MSFT WoA FC: 1/30, Pre-RTM: 3/29, RTM: 4/8.

•

Dependencies:

•

DVT-1 units' availability to all teams Must-Have DVT HW Date

–

10/18.

•

Testing with DVT-2 units is planned for 1/12 onwards.

•

Nov-Dec-Jan are holiday months both in BDC, ADC

•

Interim builds expected until SA A-rev. Careful coordination required.

•

Procure alignment with the platform and validation teams

–

Alvin Lu, Bala, Tributo CT, ETC: 8/14.

–

Completed, Platform and SW teams aligned.

•

Track 8 resources’ onboarding

-ETC: 9/8.

•

Map out the technical and tactical SW, platform and validation plan to bolster debug and disposition efforts. ETC: 9/1

•

SA team to provide early Sandbox for sub-components to commence dev testing, ETC: 11/30

Options

•

Launch SupportAssist post

–

platforms launch: Potential revenue and customer support ramifications

•

Reduce SA scope for an at -platforms launch: Reducing SA features results in minimal time saving and is seen as not a viable option.

•

At

–

Launch Recovery Plan: Implement parallel platform and SA testing for an at

–platforms’ launch alignment:

-

SA team recommendation

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BACKUP

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SupportAssist Qualcomm (Tributo/Thena) Recovery Plan

Dec

E2E SupportAssist FC

( Minimal sanity tested, no major blockers) /Sandbox+ 19 weeks from SOW-1

Jan’24

Feb

PCO A-Can29

Mar

W1W2W3W4W1W2W3W4W1W2W3W4W1W2W3W4

FS

–

Feature SetPCO

–

Partner Cut-Off

SA-E2E Testing

CP

–

Check Point15 Jan

–

12 MarPCO FC Build15158

SOW Approval8/18

SA E2E BCO

(issues are identified and locked in Jira)

SA E2E A-Can

(issues are fixed/dispositioned as per ATS process)

20

SA A-Rev

4/12

W1W2W3W4

Nov

SA-Shim Layer ported15

SA Prelim-Sandbox for dev integration

30

QC-RTS

June

Regression build will be based on A-can BIOS (4/19) and A-rev drivers (4/19)

–

A-rev BIOS to be released on 4/26

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SupportAssistCross-program milestones

Holiday time

MilestonesBradbury 5.2

Zhen

iDiags1.3.xDDVLite / DTP 3.0.xPartner Cut-offSA E2ETributoThena

SabrinaWella

(partner build drops required date)

Test/Dev Build(Dev Integration)FC

31-Oct-2330-Nov10-Nov-2315-Dec-238-Jan-2430-Nov-2311-Dec-23

BCO (App)

26-Dec-2313-Feb-241-Dec-2320-Feb-246-Mar-2427-Feb-24

A-Can

9-Jan-2423-Feb-2426-Jan-2429-Feb-2415-Mar-2429-Mar-2429-Mar-24

A-Rev (App)

31-Jan-24

5-Apr-248-Mar-245-Apr-2415-Apr-2418-Apr-2418-Apr-24

RTSTBD14-Jun-2414-Jun-24DTH 1.3 / DCF 1.3 -baseline

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•

Tributo QC is planned with one generation in 18 months of lifecycle

•TRU set to be similar with predecessor’s $1,800•

TM%adjusted lower due mainly to increased cost on SAPP but expected toimprove from predecessor with reduced cost (lower CPU cost and removal of cost brick)

RUM CB 1.0 DevPE Lifetime Proj. CPE DPE CB1.0 PPE(updated)Units (K) 798 798 266 263 263 241 241

Total Rev ($M) $1,276 $775 $485 $460 $479 $455 $438Total Margin ($M) $181 $125 $46 $64 $67 $60 $49

TRU ($) $1,599 $1,747 $1,820 $1,750 $1,820 $1,891 $1,820TMU ($) $226 $247 $174 $245 $255 $249 $205TM% 14.2% 14.2% 9.6% 14.0% 14.0% 13.2% 11.3%

TCU ($) $1,373 $1,500 $1,646 $1,505 $1,565 $1,642 $1,615Lifecycle (Months) 24 24 24 18 18 18 18

RTS MayFY23 JanFY24 JunFY25monthly run rate 33.2 11.1 14.6 13.4

Predecessor

Tributo ADL/RPL Tributo QC

Successor

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XPS Tributo QC DPE to PPE Cost Budget +$82.48

1.Carcass:+$37.92

•

NRE/box +$18.41

volume reduction from XPS (-22Ku) and the removal of Latitude (-108Ku)

•

Remaining carcass +$19.51

•

Post DPE adders +$18.86 driven by changes in MB material, camera, and cost of money

•

BA negotiation -$0.26

•

Cost of Money +$0.91 for XPS NB effective from AugFY24

2.Camera and commodities: +$45.36

•

LCD +$26.67 and camera +$5.75, change to new panel tied with FHD camera (PCR 1012506)

•

CPU -$20.00, change to Nuvia10-core from 8-core with rebate

•

Memory +$50.65, change to 16GB from 8GB at SAPP

•

Removal of two dongles -$6.99

•

QC WLAN +$3.97 per latest cost guidance

•

Power cord +$0.12 due mainly to drop of Rofus(PCR1013055)

•

Battery -$5.28, SSD -$11.12, keyboard +$1.48, adapter +$0.11

3.BE -$0.37

reference to predecessor’s actual cost

4.OS +$8.58

changes to Home Plus

5.Other SW -$1.01

reference to predecessor’s but removed McAfee

and Wave Maxx

6.Transformation: -$7.50

driven mainly by reduced Covid adder

7.Other adders: -$0.50

lowered supplier premium offset the increased license fee

Tributo QC

DPE PPE

Cost Package MonthJanFY23AugFY24CarcassTotal Carcass492.67 530.59 37.92

NRENRE33.86 52.27 18.41 CarcassRemaining Carcass458.81 478.32 19.51

ComponentsComponents18.90 24.65 5.75

CameraDual Sensor Camera->FHD Camera18.90 24.65 5.75

CommoditiesCommodities498.56 538.17 39.61

LCD13.4" 16:10 FHD NT -> New FHDNT115.33 142.00 26.67 CPUNuvia 8-core-> 10-core165.00 145.00 (20.00) Drive512GB PCIe SSD (Class 35)64.30 53.18 (11.12) RAM8GB LPDDR5x 4pcs -> 16GB49.80 100.45 50.65 WirelessQC WiFi 7 BT6.010.00 13.97 3.97 Battery55Whr, ED800 cells38.90 33.62 (5.28) KeyboardLattice-less backlit KYBD23.12 24.60 1.48 AC AdaptorBlackchin 60W Type C, Magnetite24.00 24.11 0.11 Power cordPower Cord (US) Magnetite1.12 1.24 0.12 DongleType C to Type A nano dongle -> removed2.04 - (2.04) DongleAudio Dongle -> removed4.95 - (4.95)

BE PartsDocs, Labels, Packaging10.47 10.10 (0.37) OSWin11 Home (DAO) ->Home Plus75.18 83.76 8.58 Other SoftwareOther Software3.74 2.73 (1.01) TransformationTC BTX (DAO)37.60 30.10 (7.50) Warranty 1YR Premium Support (DAO)44.44 44.43 (0.01)

Base Warranty1YR MIS33.86 33.85 (0.01) UpsellUpsell of Premium Support10.58 10.58 -

Other AddersOther Ops Adders25.90 25.40 (0.50) Total Landed Cost (SAPP Config) 1,207.45 1,289.93 82.48

Cost CategoryDelta

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XPS Tributo QC Cost Budget

SAPP L10 predict cost (DAO) landed at$1,289.93

PredecessorSuccessor

Marketing: Steven Macon

Platform

TributoTributo QC Finance: Aven Huang

Volume (Lifetime)

266,376 240,621SchM: Rachel Lin

Volume (Annualized)

133,188 160,414

Platform RTS: JunCY24 AugFY24 Cost Package (DAO)Cost Category Tributo RPLRTS costMarFY24 Tributo RPL Predicted Cost at Transition Tributo QC Budget Tributo QC Predicted Cost Comments + / - Budget +/-Pred. (Min Config Delta) +/-Pred. (carcass CPR) Carcass 437.65 429.11 530.59 530.59 - 101.48 92.94

NRE 39.73 39.73 52.27 52.27 - 12.54 12.54 Remaining Carcass 397.92 389.38 478.32 478.32 - 88.94 80.40

Components 18.91 19.00 24.65 24.65 - 5.65

Dual Sensor Camera 18.91 19.00 24.65 24.65 - 5.65

Market Commodities 676.21 639.62 538.17 538.17 - (101.45)

13.4" 16:10 FHD Non-Touch, LBL 119.83 119.83 142.00 142.00 13.4" 16:10 FHD Non-Touch, LBL (new) - 22.17 RPL i7-1360P 293.00 276.00 145.00 145.00 Nuvia 10C 45T - (131.00)512GB PCIe SSD (Class 40) 74.40 68.50 53.18 53.18 512GB PCIe SSD (Class 35) - (15.32)16GB LPDDR5 5200MHz on board 87.48 80.40 100.45 100.45 16GB LPDDR5X 8433MT/s on board - 20.05 Killer AX211 8.83 7.83 13.97 13.97 Qualcomm - QCAWCN7851 SD PMGC4 - 6.14 55Whr, ED800 cells 37.77 33.62 33.62 33.62 55Whr, ED800 cells - - Lattice-less backlit KYBD 22.77 22.67 24.60 24.60 Lattice-less backlit KYBD - 1.93 Blackchin 60W Type C, Magnetite 24.00 22.54 24.11 24.11 Blackchin 60W Type C, Magnetite (recycled material) - 1.57 Power Cord (US) Magnetite 1.13 1.24 1.24 1.24 Power Cord (US) Magnetite - - Type C to Type A nano dongle 2.04 2.04 - - Type C to Type A nano dongle - (2.04) Audio Dongle 4.95 4.95 - - Audio Dongle - (4.95)

Bulk Expense 10.10 10.10 10.10 10.10

reference to predecessors

-

-

Win11 Home Plus (DAO) 83.76 83.76 83.76 83.76


- - Other Software 3.74 3.78 2.73 2.73

reference to predecessors, but remove McAfee and Wavv Maxx

- (1.05)Transformation Cost (DAO BTX) 37.70 30.10 30.10 30.10


- - Warranty Cost (DAO Premium) 44.43 44.43 44.43 44.43


- -

Base Warranty 1YR MIS 33.85 33.85 33.85 33.85 - - Upsell of Premium Support 10.58 10.58 10.58 10.58 - -

Other Adders 25.90 25.40 25.40 25.40


- - Self-Subsidy 56.00 56.00 - -

no cost brick planned

- (56.00)Total Landed Cost (SAPP Config)1,394.39 1,341.30 1,289.93 1,289.93 - (51.37)

Tech Tax - MB HDI 1+8+1 ==> 3+6+3 19.86 Tech Tax - Consolidate in Chipset/PWR change 13.60 Tech Tax - Cost of Money 4.35 Tech Tax - Low loss MB 7.44

CPR W/O Tech Tax47.69 PredecessorSuccessorDelta

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Tributo QC NRE

DPE

100%75%

NRE ($K)

$9,421$9,421

JI Funding ($K)

$0$0Net NRE ($K)$9,421$9,421XPS Units (K)263197Latitude Units (K)10881NRE/Box

$25.39$33.86

Tributo QC/QCL% of RFQ

•

Total NRE $9.4M

1) $9.3M BA NRE; 2) $197K NRE from DCRs post BA , including $187.5K for DTC item

–

PCB EM390 to EM370 (DCR 1013056)

•

PPE NRE/box set at $52.27,

up $18.41 from DPE mainly due to volume reduction in XPS and removal of Latitude

PPE

100%75%

BA NRE ($K)

$9,251$9,251

JI Funding ($K)

$0$0

DCR 1013056 ($K)

$188$188

DCR 1011433 ($K)

$6$6

DCR 1012911 ($K)

$2$2

DCR 1013276 ($K)

$2$2

Net NRE ($K)$9,447$9,447

XPS Units (K)241181Latitude Units (K) - removed00

NRE/Box$39.20$52.27

Current NRE Amort Vol

Tributo QC% of CB

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Post DPE Carcass Changes

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© Copyright 2021 Dell Inc.28of Y


TQC Complexity

PlatformTributoQCTotalsPWB11

CPUNuvia 10CNuvia 12C

2

Memory16GB32GB16GB32GB64GB

3

WLANQC WCN785 WiFi7/BT

1PWA123455

Battery55Whr Battery

1

Adapter60W BlackChin

1

DisplayFHDNT/QHDT/3KT OLED

3

Storage512/1/2/4TB

4

CMFPlatinum/Graphite

2

Total Configs

PWB's

1

PWA's

5

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TributoQC Hero Ecosystem Line-up

Dell Premier Collaboration Combo | KM900 (RTS Q1 CY23)

World’s first zoom certified keyboard with collaboration touch

controls & comfortable optical mouse with advanced 4-way scrolling & 8K DPI to boost productivity. Dell Pair compatible to ensure seamless 1-clicking pairing experience.

Dell Premier Rechargeable Wireless Mouse | MS7421W

Get uninterrupted productivity with a rechargeable mouse that offers up to six months battery life on a full charge. Connect up to three devices and recharge in just two minutes for a full

day’s work.

Essential I/ODisplay

Bose QuietComfort Noise-Canceling Bluetooth Earbuds

Better sound begins with better silence. Designed with breakthrough acoustic innovations and the world's most effective noise canceling wireless earbuds -Reliable & high-quality calls with great comfort on-the-go. .

Collaboration

Dell UltraSharp27 USB-C Hub Monitor| U2723QE

Be your most productive on a 27 inch monitor with brilliant color

and contrast that features the industry’s first IPS Black

technology and a connectivity hub.

Dell 6-in-1 USB-C Multiport Adapter | DA305

A compact multiport adapter that offers video, network, data connectivity and up to 90W power pass-through for your laptop.

On-the-Go Accessories

Dell EcoLoop Premier Slim Backpack | PE1520PS

Lightweight and comfortable to carry, built to protect all your business essentials and allow you to stay productive on-the-go.

Dell Dual Charge Dock -Atomic |HD22Q

Powerfully productive, this compact dock is the world’s first

laptop docking station with a wireless charging stand for Qi-enabled smartphone or earbuds.

Note: For countries which KM900 is not available,

MS900

(Dell Premier Rechargeable Mouse) and

KB900

(Dell Premier Collaboration Keyboard) will be hero.

Dell Premier Wireless ANC Headset | WL7024

Collaborate with ease anywhere with this wireless headset which offers active noise cancellation

Dell UltraSharpWebcam |WB7022

Experience best image quality in its class with the world’s most

intelligent 4K webcam

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Ecosystem Readiness Breakdown

•

Tributo QC Ecosystem

–

HeroCategory

Item #Product CategoryProduct DescriptionTestOwnerTestScheduleStatus

1

AudioBose QuietComfort Earbuds II -MPN: 870730-0010, ASKU: AC246204ODMIEVReady

2

Cables, Dongles, AdaptersDell 6-in-1 USB-C Multiport Adapter -DA305ODMIEVReady

3

Input DevicesDell Collaboration Keyboard and Mouse -KM900 -Stormbreaker -KM900ODMIEVReady

4

Docks & Port ReplicatorsDell Dual Charge Dock -Atomic -HD22QODMIEVReady

5

Input Devices (Keyboards)Dell Premier Collaboration Keyboard -Trident -KB900ODMIEVReady

6

Input Devices (Keyboards)Dell Premier Multi-Device Wireless Keyboard and Mouse -Acadia IO -KM7321WODMIEVReady

7

Input Devices (Mice)Dell Premier Rechargeable Mouse -Excalibur -MS900ODMIEVReady

8

Input Devices (Mice)Dell Premier Rechargeable Wireless Mouse -Glacier -MS7421WODMIEVReady

9

Carrying CasesDell Premier Slim Backpack15 -PE1520PS -PE1520PS -FY20 Premier Slim BackpackCarrying Case Core TeamFitting test by Carrying Case Core Team. (PJM contact: Debbie.Teh@Dell.com)

10

AudioDell Premier Wireless Adaptive ANC Headset -Mito -WL7024ODMIEVUnder allocating (ETA:9/8/2023)

11

MonitorsDell UltraSharp 27 4K USB-C HUB Monitor -U2723QE -U2723QEODMIEVReady

12

WebcamDell UltraSharp Webcam -Acadia Webcam -WB7022ODMIEVReady

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TotalReady / WaiveUnder allocating

Can’t

support RTSPRTS

5646/10000

▪

All Extended/Qualified Ecosystem devices are ready

▪

Ecosystem detail status-Extended

Ecosystem Readiness

•

Tributo QC Extended/Qualified upsellEcosystem readiness

100%

Extended Ecosystem Readiness

Ready/Waive

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•


–

Extended / Qualified UpsellCategory


1

AudioBose Sport Earbuds, True Wireless In-Ear Headphones, Active Noise Cancellation, Triple Black -Bose pn 805746-0010, Dell pn AB303636ODMIEVReady

2

MonitorsDell 24 USB-C Hub Monitor -P2422HE -P2422HEODMIEVReady

3

MonitorsDell 27 USB-C Hub Monitor -P2722HE -P2722HEODMIEVReady

4

Cables, Dongles, AdaptersDell 7-in-1 USB-C Multiport Adapter -Slayer 3 MLK -DA310ODMIEVReady

5

Cables, Dongles, AdaptersDell Adapter -USB-C to Ethernet (PXE Boot) -DBQBCBC064 -DBQBCBC064ODMIEVReady

6

Cables, Dongles, AdaptersDell Adapter -USB-C to HDMI/DisplayPort with Power Pass-Through -DBQAUANBC070 -Combo Adapter -DBQAUANBC070ODMIEVReady

7

Cables, Dongles, AdaptersDell Adapter -USB-C to USB-A 3.0 -DBQBJBC054 -DBQBJBC054ODMIEVReady

8

Cables, Dongles, AdaptersDell Adapter -USB-C to VGA -DBQBNBC064 -DBQBNBC064ODMIEVReady

9

Input Devices (Mice)Dell Bluetooth Travel Mouse (Misty Blue) -Orion MLK Misty Blue -MS700 -Orion MLK (Blue) -MS700ODMIEVReady

10

MonitorsDell Collaboration 24 USB-C Hub Monitor -P2424HEB -P2424HEBODMIEVReady

11

MonitorsDell Collaboration 27 USB-C Hub Monitor -P2724DEB -P2724DEBODMIEVReady

12

MonitorsDell Collaboration 34 USB-C Hub Monitor -P3423WEB -P3424WEBODMIEVReady

13

Stands and MountsDell Dual Monitor Arm -MDA20 -MDA20 -DominionWaive from compatibility testWaive from test scope as no compatibility risk.

14

Stands and MountsDell Dual Monitor Stand -MDS19 -Hardwell -MDS19Waive from compatibility testWaive from test scope as no compatibility risk.

15

Carrying CasesDell EcoLoop Pro Backpack -FY23 Dell EcoLoop Pro Backpack -CP5723Carrying Case Core TeamFitting test by Carrying Case Core Team. (PJM contact: Debbie.Teh@Dell.com)

16

Carrying CasesDell EcoLoop Pro Briefcase -FY23 Dell EcoLoop Pro Briefcase -CC5623Carrying Case Core TeamFitting test by Carrying Case Core Team. (PJM contact: Debbie.Teh@Dell.com)

17

Carrying CasesDell EcoLoop Pro Sleeve 11-14 -FY23 Dell EcoLoop Pro Sleeve 11-14 -CV5423Carrying Case Core TeamFitting test by Carrying Case Core Team. (PJM contact: Debbie.Teh@Dell.com)

18

Carrying CasesDell EcoLoop Pro Slim Backpack -FY24 EcoLoop Pro Slim BP -CP5724SCarrying Case Core TeamFitting test by Carrying Case Core Team. (PJM contact: Debbie.Teh@Dell.com)

19

Carrying CasesDell EcoLoop Pro Slim Briefcase -FY24 EcoLoop Pro Slim BC -CC5624SCarrying Case Core TeamFitting test by Carrying Case Core Team. (PJM contact: Debbie.Teh@Dell.com)

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•


–



20

Input Devices (Mice)Dell Full-Size Wireless Mouse -Daintree -MS300ODMIEVReady

21

AudioDell Mobile Adapter Speakerphone -MH3021P -Apollo -MH3021PODMIEVReady

22

Input Devices (Mice)Dell Mobile Pro Wireless Mice -MS5120W_Black -Splinter -MS5120WODMIEVReady

23

Input Devices (Mice)Dell Mobile Pro Wireless Mice -MS5120W_Titan Gray -Splinter -MS5120WODMIEVReady

24

Input Devices (Mice)Dell Mobile Wireless Mouse -MS3320W_Atlantic (Midnight Green) -Dawson -MS3320WODMIEVReady

25

Input Devices (Mice)Dell Mobile Wireless Mouse -MS3320W_Black -Dawson -MS3320WODMIEVReady

26

Input Devices (Mice)Dell Mobile Wireless Mouse -MS3320W_Lotus (Ash Pink) -Dawson -MS3320WODMIEVReady

27

Input Devices (Mice)Dell Mobile Wireless Mouse -MS3320W_Titan Gray -Dawson -MS3320WODMIEVReady

28

Input Devices (Keyboards)Dell Multi-Device Wireless Keyboard -Corbett -KB700ODMIEVReady

29

Input Devices (Keyboards)Dell Multi-Device Wireless Keyboard and Mouse Combo -KM7120W -KM7120W -FelixODMIEVReady

30

Input Devices (Mice)Dell Multi-Device Wireless Mouse -MS5320W -MS5320W -CometODMIEVReady

31

MonitorsDell Portable Monitor C1422H -C1422HODMIEVReady

32

Carrying CasesDell Premier Backpack 15 -PE1520P -PE1520P -FY20 Premier BackpackCarrying Case Core TeamFitting test by Carrying Case Core Team. (PJM contact: Debbie.Teh@Dell.com)

33

Carrying CasesDell Premier Briefcase 15 -PE1520C -PE1520C -FY20 Premier BriefcaseCarrying Case Core TeamFitting test by Carrying Case Core Team. (PJM contact: Debbie.Teh@Dell.com)

34

Input Devices (Mice)Dell Premier Rechargeable Wireless Mouse (Graphite) -Glacier Graphite -MS7421W -MS7421WODMIEVReady

35

WebcamDell Pro Webcam -Falcon -WB5023ODMIEVReady

36

AudioDell Pro Wired ANC Headset -Winflo -WH5024ODMIEVReady

37

AudioDell Pro Wireless ANC Headset -Pegasus -WL5024ODMIEVReady

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•


–



38

Input Devices (Keyboards)

Dell Pro Wireless Keyboard and Mouse -Tasman (previous Windsor) -KM5221W

ODMIEVReady

39


Dell Pro Wireless Keyboard and Mouse (White) -Tasman Light-(previous Windsor) -KM5221W

ODMIEVReady

40

Stands and Mounts

Dell Single Monitor Arm -MSA20 -MSA20 -Shasta

Waive from compatibility testWaive from test scope as no compatibility risk.

41

Audio

Dell Slim Conferencing Soundbar -Lizzo -SB522A

ODMIEVReady

42

Audio

Dell Slim Soundbar -Ariana -SB521A

ODMIEVReady

43

Audio

Dell Speakerphone -Mozart -SP3022

ODMIEVReady

44

Docks & Port Replicators

Dell Thunderbolt 4 Dock -WD22TB4 -Salomon TBT MLK -WD22TB4

ODMIEVReady

45

Input Devices (Mice)

Dell Travel Mouse MS700 -Orion MLK (Black) -MS700

ODMIEVReady

46

Monitors

Dell UltraSharp 24 USB-C HUB Monitor -U2424HE -U2424HE

ODMIEVReady

47

Monitors

Dell UltraSharp 27 USB-C HUB Monitor -U2724DE -U2724DE

ODMIEVReady

48

Monitors

Dell UltraSharp 32 4K USB-C HUB Monitor -U3223QE -U3223QE

ODMIEVReady

49

Monitors

Dell UltraSharp 34 Curved USB-C HUB Monitor -U3423WE -U3423WE

ODMIEVReady

50

Monitors

Dell UltraSharp 38 Curved USB-C HUB Monitor -U3824DW -U3824DW

ODMIEVReady

51


Dell Universal Dock -Fischer -UD22

ODMIEVReady

52


Dell USB-C Dock -WD19S 130W -Salomon S -WD19S 130W

ODMIEVReady

53


Dell USB-C Dock -WD19S 180W -Salomon S -WD19S 180W

ODMIEVReady

54

Webcam

Dell Webcam -Shepard -WB3023

ODMIEVReady

55


Dell Wireless Keyboard -Dartmoor -KB500

ODMIEVReady

56

Security Devices

Noble TZ04T Wedge Lock (with barrel key) -TZ04T -TZ04T

ODMIEVReady

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Risk Assessment StatusRED:

Risk with no defined mitigation and/or contingency plan

YELLOW

:Risk with a mitigation and/or contingency that is being worked on but not yet approved by the Core Team and/or higher-level governance team (EPR).

GREEN

:Risk with an approved mitigation and/or contingency plan that addresses the risk and is being monitored for effectiveness

BLUE CLOSED:

Risk Item is closed with an explanation of the action taken and document the effectiveness to close the risk, date, results including resulting impact to interested parties. Should it be added to the lessons learned tracker (see comments field).

Risk Management Register

Risk of:Include impacted interested partiesProbabilityImpact Severity(High, Medium, Low)Mitigation planTrigger dateContingency PlanRisk Assessment StatusOwner (Functional group)Comments on Effectiveness of Risk Assessment Plan. Should it be added to the Lessons learned tracker?

Aitosole source risk -Aitobusiness risk in current economic climateMediumHighStrategic buy of 120k units (expected to last until May 2024 for Tributo RPL and MTL)Secure Dell access to Aito source codeQualification of 2nd source haptic touchpadDell task force to lead 2nd source haptic touchpad enablement5/1/2024Increase strategic buyDell to sustain Aito source code until 2nd source cut-inEng / WWPRISK-51PCR 1013090: Business model and PCR require approval by 8/18/23Dell Diag Tool not ready in time to support DVT1MediumMediumPartial releases to support 8/2/23 pre-test startABDD priorities have been alignedABDD continuous development of test tools8/18/2023GOE will re-assess the manufacturing Adjust the coverage in DVT1 & re-validate in ITM1Eng / GOERisk-135BIOS Attributes may not be available in time to support DVT1MediumMediumPartial releases to support 8/2/23 pre-test startDVT1 needed attributes to be implemented by 8/20/23Optimize develop plan8/18/2023GOE will re-assess the manufacturing Adjust the coverage in DVT1 & re-validate in ITM1Eng / GOERisk-136Manufacturing Modes not available in time for WBT (windows based test) developmentMediumMediumEC code for manufacturing mode switching already implementedFeatures of manufacturing modes committed for 8/8/23Partial releases for early validation to minimize risk for DVT18/18/2023GOE will re-assess the manufacturing Adjust the coverage in DVT1 & re-validate in ITM1Eng / GOERisk-137DUP (Dell Update Package) support not available at RTS, requires Dell Agile Server to support ARM MUP (Managed Update Package) to create DUPMediumLowVerify each Qualcomm MUP package with compliance verification tool (CVT)Check Agile service support ARM6411/30/232/15/24Move DUP feature to post-RTSMove MUP feature to post-RTSEngRisk-138SupportAssist support for Tributo QCLowMediumSupportAssist will skip integration testPrioritize issues to allow for faster resolutionUtilize intermediate builds to reflect changes in BIOS, etc. (as needed)Increased communication and collaboration with SupportAssist teamSupportAssist will meet platform A-can and A-rev dates2/1/2024Utilize ATS process as for all other features as needed.SW EngRisk-148

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Tributo QC NUDD

DescriptionTypeFunctionConcept RiskDefine RiskPlan Risk

Develop RiskJira LinkCross PlatformQcom

Qualcomm 8cx Gen4 Platform DesignNewEEMMMCPDM-7446ThenaY Qualcomm Power ManagementNewPowerNANAMCPDM-7386ThenaY Dock Firmware UpdatesNewBIOSNANAMCPDM-7427Thena DELL Diag Tool NewBIOSNANAMCPDM-7373ThenaY BIOS AttributesNewBIOSNANAMCPDM-7424Thena Manufacturing ModesNewBIOSNANAMCPDM-7457Thena

Multiple Driver Package Support in QualcommNewSANANAMCPDM-7311ThenaY

Windows Diags (iDiags)NewSANANAMCPDM-7405Thena Haptic TP

–

Aito solutionDifficultTPNANAMCPDM-5736MTL

Plan Phase Open NUDDs

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Tributo QC NUDD


Develop RiskJira LinkCross PlatformQcom

Battery AuthenticationDifferentADSPNANALCPDM-7434Thena USB Type-C and PDDifferentADSPNANALCPDM-7435ThenaY

Support Basic Battery ChargingDifferentADSPNANALCPDM-7436ThenaY Windows Smart Charging SupportNewADSPNANALCPDM-7437ThenaY Alert support on Battery, Adapter eventNewADSPNANALCPDM-7438ThenaY Qualcomm Audio Solution implementation NewAudioHHLCPDM-7430Y Manufacture Tools NewBIOSNANALCPDM-7408ThenaY BIOS Downgrade on QC projectsNewBIOSNANALCPDM-7399ThenaY Chassis IntrusionNewBIOSNANALCPDM-7400Thena Qualcomm based SMBIOS Requirement InvestigatingDifferentBIOSNANALCPDM-7439ThenaYQualcomm DELL Factory flash ToolnewBIOSNANALCPDM-7398ThenaY Hawkeye Repo/Build EnhancementsNewBIOSNANALCPDM-7397Thena Port Dell Property Services to HawkeyeNewBIOSNANALCPDM-7392ThenaY Port Dell Basic Services to HawkeyeNewBIOSNANALCPDM-7395ThenaY BIOS PasswordsNewBIOSNANALCPDM-7389ThenaY


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Tributo QC NUDD


Develop RiskJira Link

Cross Platform

Qcom

UEFI Secure BootNewBIOSNANALCPDM-7396ThenaY BIOS Firmware Secure BootNewBIOSNANALCPDM-7394ThenaY Firmware Update verificationNewBIOSNANALCPDM-7388ThenaY Preboot Behavior -Errors and WarningsNewBIOSNANALCPDM-7403ThenaY Clear TPM, HDD Wipe, NVRAM data (Service Repair Depot)NewBIOSNANALCPDM-7404ThenaY Firmware UpdateNewBIOSNANALCPDM-7384ThenaY Firmware Recovery-Qualcomm SolutionNewBIOSNANALCPDM-7383ThenaY Preboot Diagnostics (eDiags)NewBIOSNANALCPDM-7381ThenaY MAC Address Passthrough to DockNewBIOSNANALCPDM-7425Thena HTTPS Boot support for ARM64NewBIOSNANALCPDM-7426ThenaY Passive Cooling (Windows Thermal Framework)NewBIOSNANALCPDM-7429ThenaY TPM SupportNewBIOSNANALCPDM-7393ThenaY BIOS HDD PasswordsNewBIOSNANALCPDM-7391ThenaY HW Security ConfigurationNewBIOSNANALCPDM-7390ThenaY SAFE Manufacturing AccessNewBIOSNANALCPDM-7387ThenaY Preboot Behavior -DisplayNewBIOSNANALCPDM-7401ThenaY Low Power ManagementNewBIOSNANALCPDM-7402ThenaY Device Disablement (enable/disable) + Misc USB Preboot SupportNewBIOSNANALCPDM-7406ThenaY TZ Framework -Move a reduced version of EDK SMM infrastructure to TZNewBIOSNANALCPDM-7407ThenaY


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Tributo QC NUDD


Develop RiskJira Link

Cross Platform

Qcom

DACI FrameworkNewBIOSNANALCPDM-7379Thena Preboot Behavior -Boot SupportNewBIOSNANALCPDM-7380ThenaY NVMe storage device firmware updateNewBIOSNANALCPDM-7382Thena Support for Dell Telemetry PlatformNewBIOSNANALCPDM-7378Thena USTT Power ModesNewBIOSNANALCPDM-7428ThenaY Automatic Display brightness using ALSNewBIOSNANALCPDM-7469Thena System Configuration detection and delivery providing system orientation, hinge angle and platform lid modeNewBIOSNANALCPDM-7440ThenaYWoA Active CoolingNewECNANALCPDM-7452Thena Device backlight management based on ALS data for keyboard or touch rowNewECNANALCPDM-7453Thena Mailbox over I2C_Glink on ARMNewECNANALCPDM-7454Thena Boot Failure Visual Events (Diag LED)NewECNANALCPDM-7456Thena Type-C Port Disablement NewECNANALCPDM-7460Thena TFR SupportDifferentECHMLCPDM-7461

Porting Warlock LED error codes and general LED behaviorsNewECNANALCPDM-7462Thena MEC5200 image authentication.encryption frameworkNewECNANALCPDM-7465Thena EC Firmware update MBOX interface on QCOM platform AD 1.0NewECNANALCPDM-7467Thena

eSOL for Qualcomm platform on MEC5200NewECNANALCPDM-7468Thena Porting_Warlock_KBC_Scan_Code on MEC5200NewECNANALCPDM-7458Thena


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Tributo QC NUDD


DevelopRiskJira Link

Cross Platform

Qcom

Porting Warlock Hot-Keys on MEC5200NewECNANALCPDM-7459Thena Porting other GPIO Functionality on MEC5200NewECNANALCPDM-7463Thena Basic MEC5200 and ADSP Bring-up Framework NewECNANALCPDM-7464Thena MEP Enablement on SC8380XPNewSANANALCPDM-7302Thena Windows11 SV23 support on ARMNewSANANALCPDM-7292Thena AptX Lossless Enablement on SC8380XPNewSANANALCPDM-7450Thena New Y2.7mm FHD RGB Camera for Qualcomm ISPNewCameraMMLCPDM-7235ThenaY FHD Camera Status LED Light Leakage ConcernDifficultCameraLLLCPDM-7236MTL QHD+/FHD+ Panel with 1.3mm BL Top BorderDifficultLCDNANALCPDM-7478MTLQHD+ incell touch panel NewLCDNANALCPDM-7479MTL 3K OLED PanelNewLCDHHLCPDM-7480MTL Qualcomm Display SolutionsNew/Difficult LCDLLLCPDM-7481Y QC I2C over AUX OLED T-con FW rework DifficultLCDNANALCPDM-7482MTLYLGD OLED eSOL functionDifferentLCDNANALCPDM-7483MTL

NUDD : Same A-cover with 2 different size camera logic PCBA

support for QC and MTL

NewMENANALCPDM-4432MTL

LPDDR5x 8400MT/sNewEEHHLCPDM-7445ThenaY Qualcomm USB4 SolutionsDifferentEEMHLCPDM-7447ThenaY Tributo QC Battery LifeNewEELLLCPDM-7448ThenaY Qualcomm WiFi and BT SolutionsNewRFLLLCPDM-7470ThenaY Thermals 17.5W Optimized ModeDifficultThermalLLLCPDM-7484


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Copyright © Dell Inc. All Rights Reserved.43of Y

TributoQC Innovation Story

ClaimHowAOD/TT#StatusContact

Natural Immersive UX

1.High (Full) Fidelity Audio Path2.Bluetooth Lossless Audio3.Intelligent Collaboration (MEP)

4.

“Dark Light 2.0” Adaptor with provision for XPS Light Pollution

reduction5.Pre-OS Bluetooth HID Integration for Dongle Free operation1.6372.5983.455

4.410

5.3261.AOD / IRL 22.AOD / IRL 23.TT / IRL4

4.AOD / Gov 2

5.Drop (X86 only)1.Doug Peeler2.Harpreet Narula3.Jason Lee

4.James CC Wu

5.Harpreet Narula

Seamless & Persistent Connectivity

1.Longer playtime: Synchronous Dynamic Power Control2.BT AoA/ AoDbased Device Positioning3.Device Localization with Bluetooth High Accuracy Distance

Measurement

1.5822.4893.291.AOD / IRL 32.AOD / IRL 23.AOD / IRL 31.Harpreet Narula2.Harpreet Narula3.Harpreet Narula

Worry Free Power

1.ED 800Wh/L support EC 2.02.Energy Density, 850Wh/L1.5542.5531.AOD / Gov 22.AOD / Gov 21.Jay Chang2.Jay Chang

Contextual Performance

1.Flat end Heat Pipe

2.Slim Stainless Steel Vapor Chamber3.Proactive Thermal Fan Control on AC (PTFC)

1.587

2.5323.526

1.AOD / Gov 2

2.AOD / Gov 23.AOD / IRL 4

1.Enoch Chen

2.Enoch Chen3.Travis North

Foundational

1.

“Dark Star” SFF 100W Type

-C adaptor using Hybrid Flyback1.4531.AOD / IRL 41.Jason Yu1

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XPS NB MTLClean Launch Overview

XPS PMO

ad

Executive Summary

–

Clean Launch Overview for MTL Programs

Background

(What defines a platform Clean Launch?)

Highlights

➢

XPSMTL platform RTO:

➢

[Do differently / Continually Improvements]

–

✓

Launch Transparency Team Governance & Beacon Tower

✓

FV Entry to LPE

✓

PCR Governance

✓

Reduce last minute changes for better clean launch (BCO to RTS)

✓

No new PCR scoping after T-12 to allow CT resources focusing on delivering defined RTS scope.

✓

ATS-P1 issues disposition governance. CT to closely monitor from RFD to RTS.

✓

➢

[Cross Platform Achievement]

✓➢

[Cross Platform On-going activities]

✓

Vietnam enablement

✓

[

➢

[Program Specific Issues]

✓

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46of Y

Internal Use -ConfidentialClient Program Management


Quality

–

FIR

POR highlights:Post PPE Highlights:Reference docs: Program Plan 1.0; PRD 2.0; FM2.0; ARD2.0; Ecosystem 2.0; Plan DD deck.

1.All program and technical LL implemented. NUDDs identified with plan in place. Validation/test cases enhancement also reviewed in deep dive discussions.

Reference docs: T-12, Mid-

DD deck, PCRs (Planview) MRP…etc..

20232024

JanFebMarAprMayJunJulAugSepOctNovDecJanFebMarAprMayJunJulAugSepOctNovDec

Architecture: RPL

Define PlanDevelop LaunchSustaining

PillarMetrics

CPEDPEDDSDDSBAMPDDPPEIEV EntryULV EntryFCMDDD BCOPPAPFV EntryRFDRTSRTO

StatusComments/Post-POR

Q u a l i t y ( F I R T a r g e t )

Program LLTech. LL, NUDD

Cross PlatformsDiablo MTLTributoQC/MTLPistaMTL

Cross Platforms

−

All LL and NUDD were reviewed in DD.

−

Implement PCR governance at T-12 to avoid resource disturbance.

−

Extended EQM : , Apply 100% in line EQM cosmetic inspection for first 10K; Keep the off-line EQM sampling rate at 10% from 1K to 10K

Diablo MTL

−

PistaMTL

−.

TributoQC/MTL

−

Tech. LL, NUDDATS ClosurePCR GovernanceExternal DVT2 AuditLT solution implementextended EQM for premium products

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47of Y



POR highlights:Post PPE Highlights:Reference docs: FM2.0, PRD2.0, ARD2.0, pNPStiger team tracker and quarterly review data.

1.VoC/LL: Solutions identified and implemented2.pNPSenhanced features & SPEC have been captured in the POR scope.

20232024


Architecture: RPL


PillarMetrics




Experience -pNPS

Pre. Gen LL / VoC

Cross PlatformsDiablo MTLTributoQC/MTOPistaMTL

Cross PlatformsDiablo MTL

-.

PistaMTL

-

TributoQC/MTL

−

New smart amplifier New Spider Transducer New CameraNew Spider Transducer New smart amplifier

New CameraBattery Life ImprovementThermal improvement

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48of Y



POR highlights:Post PPE Highlights:

Reference docs: Plan DD deck…etc.

1.Manufacturing and operation related issues/LL checked and implemented2.ER build and pilot build issues closed

20232024


Architecture: RPL


PillarMetrics




Zero Excursions -Factory Revenue/CQM Field Escalations

Predecessor Factory & Field Issue


Cross Platforms

−

Expedite unit capture and FA process with ODM

−

Social media early detection.(Reddit, Youtube, Dell community)tracking and provide daily social media update of potential issues.

−

Exchange customer new units if dispatch 3 times.

DialoMTL

PistaMTL

-

TributoQC/MTP

Fix Fast3

rd

Strike

TP auto-binding process

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49of Y



Frictionless GTM

POR highlights:Post PPE Highlights:

Reference docs: CB1.0, Ecosystem 2.0; Plan DD deck…etc.

1.

20232024

FebMarAprMayJunJulAugSepOctNovDecJanFebMarAprMayJunJulAugSepOctNovDec

Architecture: RPL

DefinePlanDevelopmentLaunchSustain

PillarMetrics

CPEDPEDDSBAULV EntryMPDDPPEIEV EntryFCMDDDBCOFV EntryPPAPRFDRTSRTO




Cross Platforms

-Risk buy long leadtimematerials to support RTS demand.

Diablo MTLPistaMTL

TributoQC/MTL

Risk Buy

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TributoQC Tooling Release Waiver

2023/4/7

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51of 22

Client Solutions | Program Management


Tributo MTL-Tooling Release before PPE

•

TMTL tooling release on 4/14 before PPE (5/23)

•

To maintain critical mechanical schedule readiness to support RTS.

•

Cost summary:

total $324,400 to cover DGP managed parts tooling & fixtures

•

Business impact:

•

Support RTS: 2/20/2024

•

Risk level:

Tooling risk level is

LOW

•

ME design review / Mockup review / Tooling release check list completed.

•

MU tests are pass ,no ME tooling related action is required.

1

Recommendation: Approve TMTL Tooling Release on 4/14/2023

OLED A cover Risk Go$290,400QHD A cover Jig Fixture Risk Go$34,000$324,400

Note: TributoQC included in this approval

–

due to leverage

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52of 22

Client Solutions | Program Management


Function Aligned to Proceed T/R

•

MKT

approved

4/7 (Donnie)

•

ENG

approved

4/6 (Sharon)

•

SQE

aligned to proceed

4/6

•

CT

aligned to proceed

3/29

* WWP is acknowledged, per new process approval is no longer required.

Note: TributoQC included in these approval

–

due to leverage

ad

Tributo MTLThermal Module Risk Go

May 23

rd

, 2023Michelle ChenTributo MTL Core Team

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▪

Executive Summary: The purpose of this one-pager is to provide executives with a concise overview of the risk go approval request for the thermal module in the TMTL mechanical critical path. This critical step is necessary to trigger the preparation of the thermal module by 5/24. The thermal module tooling/fixatures fabrication will start before PPE requires engineering agreement/alignment on design readiness and MKT's approval on cost.

▪

Per Engineering confirmed, this is the only risk go required before PPE(6/6)

▪

Background:

▪

TMTL's PPE is revised to 6/6, necessitating alignment with the new SAPP. The revised DAO SAPP will include Ci7, while ensuring backward compatibility with i5 (Ci5 will remain within the program scope).

▪

Due to the cost/pricing strategy, additional time is required for alignment, resulting in the shift of PPE from 5/23 to 6/6.

▪

In order to maintain the mechanical critical path schedule, it is essential to release the thermal module for fabrication on5/24.

▪

Key Details:

▪

Total amount: $124K

▪

Heatsink $30k *2 suppliers= $60K

▪

Fan $32K * 2 suppliers= $64K

▪

Engineering assessment completed, thermal module ready for fabrication, and the risk is low..

▪

Timeline:

▪

Risk go approval request: 5/23/203 to catch July DVT1 build.

▪

Fabrication start date: 5/24/2023

▪

Core Team Recommendation: Approve the thermal module risk go (approved at 5/23/2023 XPS BRM)

Tributo MTL Thermal Module Risk Go

Note: TributoQC included

–

due to fan leverage

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Quality

ad

Erwin Chang2023/08/14

Tributo QC

(Qualcomm Nuvia)

XPS 13 9345

Plan Phase Exit

ProgramSeriesChipsetConcept EntryConceptExitDefineExitBADeep DivePlan ExitDev. ExitRTS (L10)

Tributo QC

13”

QC9/27/2211/15/222/9/236/20/238/1/238/17/23May 2024June 2024

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Quality Status

Tributo QC: Plan Phase Exit

Risk AssessmentGoalsCritical Learnings

FY25 GoalPlatformPredecessor (N-2) / (N-1)IFIRFIR

Tributo QCTributo ADL / RPL

(1.33%)

1.84%

(16%)

14.1% Goal

* FY24 Primary predecessor data is Tributo ADL (N-2). Will update with included RPL (N-1) data (starting May23) once available at T-14 mid dev health check

Lessons Learned & Keys for Success

(TribMTL Lev.)

Status

•

Touchpad: Stuck+Non-Func/Noise (CSGLL-258+ QIT-7276)

•

Updated FW: Runtime Cal. (Stuck) & Reduced Haptic Drive Spec Limit (Non-Func/Noise)

•

PoR

•

AC Adapter LED Behavior (QIT-7154)

–

Revert to LED Legacy Behavior

•

PoR

•

LCD/A-Cover Bonding (CSGLL-250)

–

Tape Supplier + ODM process improvements

•

PoR

•

Slow Performance / Throttling

•

CSGLL-269

–

Updated Val. Tests + ODM DFX (

Thermal Sensor Design Guidance_V02

)

•

PoR

Key Quality Risk Items

Source

•

FIR/VoC:Dell developed SW/FW/BIOS for Qualcomm

Architecture

•

NUDD

•

VoC: 17.5WOptMode / 28W Perf Thermals(

Note: Still Grade 3 as ADL/RPL/MTL

) •

Tributo MTL Lev.

concave fan design (1.3D)

•

NUDD/VoC

•

VoC: Poor BatteryRuntime:

Complaints of <4hr runtime w/ OLED •

QC OLED targeting

>50% over ADL (enabled w/ improved Panel / QC)

•

NUDD/VoC

•

FIR/RSV: New OLEDSupplier:

TribMTL Lev.

(Conttriggered: Glass to 0.4mm)

•

NUDD

•

FIR/VoC: New Y2.7mmFHD Camera:

TribMTL Lev.

(Image Qual / Light Leakage)

•

NUDD

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Tributo QC FIR Bridge Details -XPS

19.5%27.0%14.1%

7.5%4.6%0.20%1.20%6.9%

-28%

Baseline+ RisksTributo ADL BaselinePredecessor (FIR Actual)NUDDRisksRiskContainmentLessons Learned & ImprovementsTributo QC Direct Goal

-8.3%

-28%

LL: Engr Other FIR Impacts

*Improvement versus n-2 predecessor

NUDD Risks

Key FIR impacts from new technologies

(Engr + SW alignment)

Risk Containment

Ability to screen issues that may result from risks

(Engr + SW alignment)

FIR Goal

FIR based on risks, containments, improvementsTributo ADLBaselinePredecessor (Overall)TribQC FIR Projection (Overall)

15.6%11.1%

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Quality ResponsibilityCore Team ResponsibilitypNPS/5*Category and Root WantSupporting VerbatimsCT Supp (Y/N)If not, why.

6-10System Temperature

•

#1 negative category from detractor / passive commentary re: system overheating while normal load usage and AC/DC mode. Users complain about system heats when used on lap.

•

Throttling issue addressed with a BIOS fix

•

~1.9x

increase in negative complaints compared Modena TGL, attribute score dropped for Tributo (

6.5

-985) vs Modena TGL (

7.4

-1318)

“Great laptop! Does get quite warm during use if you have on your lap.”“Fast, amazing screen, good audio, typing experience is

great. Battery not big enough, gets very hot under even

light load.”

Note:

ADLVoCaffected by knownTributoThrottlingissue (CSGLL-269).Since CA in place,TributopNPShas improved MoM (6.5>7.4).

Yes:

Specified thermal grade 3:3 (Similar to TribADL/RPL/MTL). Target TDP is 17.5W optimized for2deg improvement and leveraging MTL concave fans

for incr. margin of ~1.3D.

5.8-8.8Battery Runtime

•Tributo users aren’t delighted with < 4

hrsbattery runtime. Primarily driven by OLED attach rate. ~2.5x increase in OLED shipments for Tributo (42%) when compared to Modena TGL (~15%)

•

Initial battery exp. Score for Tributo declined to ( 7.0

–

1037) vs Modena TGL ( 7.7

–

4837)The XPS OLED screen is fantastic. The M1 screen is good but nowhere near the quantity of the OLED. The XPS battery life is far worse than the M1. The M1 easily

lasts 2x longer”“Battery is terrible! The i7

-1260p with OLED model only has less than 4 hours battery life for light load. And if it is heavy loaded, it will be less than 2 hours. This is

completely unacceptable for a 13 inch ultra book.”

Yes:

FM updated to FHD 20hr Netflix streaming(compared to 13hrtributo) Incr.IncrBatteryperformance due to QC and improved Panels (OLED11.5hr targeted).Confirm simulation data in later stages of dev to

ensure meeting new requirement.

5-8Touchpad

•

Erratic T/P behavior, intermittent functionality loss are key callouts from early CE feedback. Considering this is the first time launching haptic T/P in XPS LoB, lessons learned should be applied and validated for future gen

•

Attribute score dropped to ( 7.1

–

988) when compared to Modena TGL ( 8.2-1289)

“Touchpad issues and occasional freezing on battery“Track pad intermittently working needs to get fixed““The haptic motors in the trackpad sometimes get stuck in

the "clicked" position. There's no option to delay trackpad response after typing, causing significant typing issues.

Yes:

Known TP issues affecting predTributo(Intermittent/Slow Click CSGLL-258 and TP Non-functional QIT-7276):NUDD created (as a resultfor ENG tracking and team will ensure all TPLLdareactively addressed prior to RTS). Mitigations in place with updated FW. To be validated w/ 1-

2 Button test in dev.

Tributo VoCfeedback

pNPS

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Backup

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◼

Issue Description:

Customers are complaining No work/Noisy, which be haptic IC channel be damaged already (1 yr-FIR 0.8%)

◼

Impact

: User is not able to use touchpad correctly

◼

Root Cause

➢

Unexpected load of IC which cause IC damaged.

✓

The voltage is based on the FW algorithm with 5V. Vendor did not consider the tolerance (5V+/-10%) which make the voltage may over 200V and cause unexpected load to damage the IC.

•

If set the high voltage of 196V, it boosts comes from 5V input, which allows 10% deviation, so it has the risk to cause overshoot 200V

•

If an unexpected load happened (may cause by Noise or power unstable) when piezo charging, it will cause the recharging voltage jump back to 200V or the circuit current too high to damage the circuit.

◼

Solution

➢

Lowering Haptic Drive Operational Specification from 195V to 170V.

✓

Improvement implement into latest FW, FW2023-06-05.

◼

Conclusion

➢

Do button cycle test to verify the new FW, FW2023-06-05, in Compal:

✓

Pass rate: 10/10, 100%. Pass cycle: 2 million/ unit.

➢

New FW implement into Compalproduction on 6/23.

➢

New FW complete web-post process on 6/21.

➢

Tracking FIR result if any improvement.

◼

Lesson Learnt

➢

TP vendor_AITO:Need to confirm the voltage limit setting from design review.

✓

For next future design , if IC has a booster function with kind of high voltage, need to ensure suppliers have related life testto mitigate risk.

✓

Adding this item into CompalTP team checking list.

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Note: Battery capacity for battery life estimation can be reduced to about 54Whr due to 1.1W(TBD) reservation for Dell storagerequirement, instead of RTC coin cell.

Summary of Tributo QC Battery life Estimation:

Test ScenarioMSVideo Playback (VPB)Netflix StreamingWeb Broswing

CPU,LP-DDR5X,SSD,Battery (WHr)

Qualcomm SC8380XP/LP-DDR5x 16GB/NVME 512GB/55WHr

Panel

New FHD+New QHD+New LG OLEDNew FHD+New QHD+New LG OLEDNew FHD+New QHD+New LG OLEDNew FHD+New QHD+New LG OLED

Touch Screen

NoYesYesNoYesYesNoYesYesNoYesYes

ARD v1.5 Battery life (Hr)200.0 200.0 200.0 29.0 21.5 16.5 20.0 16.5 11.5 12.0 12.0 N/AEstimation Battery life (Hr)204.0 204.0 204.0 29.6 21.9 16.8 20.4 16.8 11.7 13.3 12.2 9.2 Estimation Total Power (W)

0.269 0.269 0.269 1.826 2.462 3.209 2.647 3.209 4.604 4.072 4.412 5.882

SoC Chipset

+3.3V_VPH1A/VPH1B

0.1100.1100.1100.6910.6910.6911.4001.4001.4002.1602.1602.160

RAM

+1.8V_MEM

0.005 0.005 0.005 0.019 0.020 0.019 0.025 0.031 0.038 0.025 0.031 0.038

+1.065V_MEM

0.033 0.033 0.033 0.202 0.201 0.204 0.266 0.353 0.445 0.266 0.353 0.445

+0.65V_VDDQ

0.002 0.002 0.002 0.003 0.003 0.003 0.004 0.010 0.017 0.004 0.010 0.017

+3VALW

+3VALW_output

0.087 0.087 0.087 0.666 1.387 2.112 0.815 1.661 2.288 0.815 1.661 2.288

+5VALW

+5VALW_output

0.095 0.095 0.095 0.095 0.095 0.096 0.089 0.052 0.084 0.089 0.052 0.084

+5VALWB

+5VALWB_output

0.005 0.005 0.005 0.005 0.005 0.005 0.004 0.004 0.004 0.004 0.004 0.004

Panel

+LCDVDD

0.001 0.001 0.001 0.364 0.674 1.396 0.364 0.835 1.908 0.364 0.674 1.408

+INV_PWR_SRC

0.001 0.001 0.001 0.208 0.311 0.291 0.208 0.317 0.573 0.208 0.311 0.407

Touch screen

+3VS_TS

0.000 0.000 0.000 0.000 0.033 0.021 0.000 0.033 0.021 0.000 0.033 0.021

WLAN

+3VA_WLAN

0.036 0.036 0.036 0.062 0.063 0.054 0.159 0.195 0.175 0.159 0.195 0.175

Camera

B+_CAM

0.024 0.024 0.024 0.024 0.024 0.024 0.024 0.025 0.025 0.024 0.025 0.025

+3VS_MID

0.005 0.005 0.005 0.005 0.005 0.005 0.005 0.005 0.005 0.005 0.005 0.005

Audio_L

+12V_AMP_L(B+)

0.002 0.002 0.002 0.002 0.002 0.003 0.002 0.003 0.003 0.002 0.003 0.003

Audio_R

+12V_AMP_R(B+)

0.004 0.004 0.004 0.006 0.005 0.005 0.004 0.005 0.005 0.004 0.005 0.005

FPR

+3VS_FP

0.002 0.002 0.002 0.002 0.002 0.002 0.001 0.001 0.001 0.001 0.001 0.001

EC

+3V_5200

0.013 0.013 0.013 0.028 0.027 0.028 0.030 0.029 0.030 0.030 0.029 0.030

Touch pad

+3VS_TP

0.003 0.003 0.003 0.002 0.002 0.002 0.003 0.003 0.003 0.003 0.003 0.003

SSD

+3VA_SSD

0.124 0.124 0.124 0.124 0.147 0.114 0.093 0.091 0.121 0.093 0.091 0.121

+1.8VS Total

+1.8VS

0.000 0.000 0.000 0.001 0.000 0.001 0.000 0.000 0.000 0.000 0.000 0.000

+5VS Total

+5VS

0.002 0.002 0.002 0.002 0.002 0.002 0.002 0.002 0.002 0.002 0.002 0.002

+3VS Total

+3VS

0.024 0.024 0.024 0.039 0.044 0.039 0.053 0.064 0.076 0.053 0.064 0.076

TPM

+3.3V_VPS_TPM

0.003 0.003 0.003 0.003 0.002 0.003 0.002 0.002 0.002 0.002 0.002 0.002

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GOE

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TributoQCPlan phase Exit

TM/RM: Mic Wang

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Agenda

68

TopicReporter

➢

PlanPhase DashboardMic Wang(RM)

➢

Master Operations Readiness ScheduleMic Wang(RM)

➢

Global Integration and Fulfillment ModelMic Wang(RM)

➢

Supplier Audit PlanMic Wang(RM)

➢

Plan Phase NUDD SummaryMic Wang(TM)

➢

NUDD Implementation PlanMic Wang(TM)

➢

DFM ScorecardMic Wang (RM)

➢

E2E Safe launch KPI goalsMic Wang(RM)

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Plan Phase Dashboard

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Master Operations Readiness Schedule

1.Key Milestones:

•

RFD 5/17, WWFRC/RTS: 6/142.ME phase gate follow TributoMTL (leverage chassis). The PPAP review will be 12/2 (FHD A cover/Palmrest) & 1/8 (OLED A cover)3. VN Pilot andMBlaunch:

•

VN SMT resilience and BCP L10 FRC target 6/4

•

VN MB launch at RTS (6/14) with actions aligned in CT for cost liability and cost adder alignment :a.PCB raw material risk go, trigger date: 3/18b.PCB logisticchangefrom truck to Air c.Expedite HDI PWB production L/T 4. No ICC/BCC Dell factory local build5. Matrix build verified: passed on TributoMTL and will not conduct on TributoQC

Key Message

OLP/Phase gate

S y s t e m b u i l d

CKS build

F u n c t i o n a l P l a n

VN build

WBTFish-FIV

ME

ValidationITM

5/21/2024Qual phase exit6/11/2024Pilot Phase exit

6/15

–

8/13Ramp

DVT19/13-10/16DVT212/18-1/12DVT2 CTO1/22-3/5

Pilot5/20-6/3PVT6/4-6/14

DHC111/16DHC212/15

DHC34/17Drawing modify10/18

PPAP12/2

PCB ETA4/24

DVT1 GAFP9/19

2/1But Cut off 11/30Feature complete

PCBA arrive CKS

A00 Gerber3/17/2024

VN SMT4/26-5/10

9/28-4/19IEV

5/22-6/14Pilot

8/13/2024Ramp Phase exit

MP PCB ETA5/9

Pilot build5/20-6/3

Resilience/L10 FRC6/3

7/10-9/28ULV8/18-5/21Qual

4/20-5/17FVPVB12/1-12/14ITM112/1-12/14

ITM2 4/1-4/15PVB 4/1-4/15

AcanBiosCan Driver4/19A rev Bios4/26

EngRgr4/23-5/17

Quarter end4/20-5/3

ME Phase gate #3 11/8

DVT1 Bios8/28DVT1 WBT9/21ITM1 GAFP11/27ITM1Bios11/15ITM1 WBT12/1ITM2 GAFP3/26ITM2Bios3/13ITM2 WBT3/29

SMT9/13MB9/21SMT12/18MB12/25RFD5/17Sub Build9/18Sub Build12/22SMT4/23MB12/25Sub Build4/24ECFC/FRC6/14RTS6/14

Today

ME Pha

se gate #2 8/8

Plan phase exit8/17

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Global integration and fulfillment model

CHALLENGES / DEPENDENCIES:

▪

241K volumes over18 months. DAO 62%; EMEA 25%; APJ 13%

▪

No Dell factory (ICC/BCC)local build

▪

VNOne FRC and one-time RTS in POR:

▪

VN SMT resilience and CKS L10 Pilot complete in WW FRC (6/4) scope,

▪

RTS with VN MB to fulfill DAO demand (DSI ready).

RegionEMEAAPJDAOFactory CKSCKSCKSVN SMTFedexCKS L10

FRC6/1414-Jun14-Jun4-Jun19-Jul

RTS14-Jun

RTO2024 June

Volume 60.5K31K149.5K

Assembly LevelL10L10L10L10L10DBMFGAYYYYYCatalog BTOYYYYYCustom BTOYYYYY

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Supplier Audit Plan

LocationYr23Audit PlanOwner

Compal KSClass 3, leverage TributoLarry Zhou

ODM QPA PlanSub-tier Audit Plan

PartsLocationPrevious Audit TimeYr23Audit PlanOwner

A cover & Palmrest

Catcher1/3/20234/6/2023XuanyaoZhuRishan10/18/202210/15/2023XuanyaoZhuD Door Dazhi10/21/20203/16/2023XuanyaoZhuFuyu10/26/202110/18/2023XuanyaoZhuOLED LGDNA2023/JuneSean Wu

Key message:

1.TributoQC as Class 3 program by leverage Tributochassis. QPA waive2.ME parts supplier audit target complete by Oct/2023

Sub-tier Audit Plan

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Total Risk Score

15.2530.5020.00

TributoQC (XPS/Latitude)Phase NUDD Summary

Key NUDDNewUniqueDifferentDifficultTarget Closed Date

F M / A R D / F a c t o r y

First ARM64 network setup

M

DVT1

First ARM64 WBT enablement in manufacture

M

DVT1

New TademOLED enablement from Supplier side

M

DVT2

Second Source TouchPadenablement

MEngRgr

Concern on supplier test tool readiness to support production

M

DVT1

4

1

1

24

00028500

4

80015.2530.5020.000.000.000.005.0010.0015.0020.0025.0030.0035.0001

2

345678

9

10ConceptDefinePlanQualPilot

# of Low Risk

# of Medium Risk# of High RiskTotal Risk Score

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First ARM64 network setup

Mitigation PlanRisk Driver Risk Event

Risk Level: Medium

•

NUDD item

:

Capability concern to setup new ARM64 PXE network in manufacture

•

Capability concern to setup new ARM64 PXE network in manufacture

•

ODM/FedexfactoryuseIPXEbutonlysupportX64/AMD based, concern on ARM base readiness

•

Dell ICC/BCC factoryuseRemboto support PXE on X64/AMD based

(NOT POR)

•

Engineer is consulting Qualcomm on the Winbootto enable IPXE network bot before DPE (1/17) Done

•

Qulacommprovides winbootand GTS will help to verify in CDC lab before DPE (1/17) Done

•

GTS received Warlock NQ device 8/16 and started flashing Qualcomm Bios. Done

•

ODM test positive with ARM64 in MFG to connected PXE Server Done

•

ODM use EVT1 unit to verify IPXE boot in CKS by Aug/Mid

•

Monitor on DVT1 (9/22)

•

SW engineer allocate one Lati seed unit to Rembocompany for ARM support assessment and target receive mid/Sept (Done)

•

HCL is under debugging with Microsoft on visual studio compiler (case#2211160010001145.) In the meantime, HCL is using new environment Linux to compile.(Done)

•

GTS testing Warlock NQ positive in CDC lab with new Remboand compatible with x64 and ARM64 coexistent.

（

Done)

•

GTS will verify Remboin CDC lab using TributoQC DVT1 unit. Target 8/1

6

Mitigation implementedRisk w/ MitigationRisk w/o Mitigation

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First ARM64 WBT enablement in manufacture


Risk Level:

Medium

NUDD item

: Concern on manufacture test readiness to support Qualcomm

•

Concern on WBT manufacture test readiness to support Qualcomm

•

First ARM64, concern on the test coverage to have WBT support under Winpeenvironment for system level test (New to Dell)

•

GTS provide MVP (Bios requirement) list as minimum test coverage due to engineer resource constraint before CPE (11/15)

（

Done)

•

GTS provide engineer the TCRM (S01892) that need to meet PCBA testing/L10 testing before DPE (1/17)

（

Done)

•

WBT process tool development will target complete Feb 17

th

by GO team.

（

Done)

•

WBT development is based on below timeline and will conduct MdiagPre-test starting on 8/2

–

8/21

•

Bios test tool

features complete by 8/20 and aligned with engineers on the following approach.

•

Partial bios release in weekly basis and have test coverage check by 8/18

•

MFG Modes:

Features complete by 8/9. Aligned check point by 8/18 to understand the test coverage

•

ABDD

features complete by 8/16 and aligned with engineer on the following.

•

ABDD continue to develop test tool while waiting for engineer partial feature release. Check date 8/18

•

Mdiag(WBT) official integration starts from 8/22

–

9/20, aligned with engineers on the following approach.

•

AGS Bios

release for 8/22 and have FI Core and ABDD pre-test on EVT 1 boards.

•

Mdiagand Fish/Fiv

use EVT 1.1 boards to verify DVT1 AGS bios/drivers

•

Keep monitor on DVT1 (9/22/2023)/ DVT 2 (Jan/2024) to ensure test coverage meet MFG requirement


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New TademOLED enablement from Supplier side


Mitigation PlanRisk EventRiskDriver

Risk Level:MediumNUDD Item:

LGD 3K OLED supplier capability concern

•

LGD capability concern to support OLED panel

•

LGD OLED panel is new to Dell and concern on the inspection method for Think film encapsulation

.

•

Concern on the process capability by transferring production line from Korea to Vietnam (new site, first time produce OLED)

•

Concern on the bonding parameters values for new OLED panel and might have potential impact cause crack or fell off

•

CTF

station defined for “Thin film encapsulation” and request

LGD to conduct 100% AOI and provide inspection before before

Feb/beg.

（

Done)

•

LGD proceed a 200pcs sample trial on July/23 and result positive.

（

Done)

•

LGD MFG first build in Vietnam from DVT1 , ETA 9/13 CKS.

▪

Korea factory process/equipment 100% duplicate

to Vietnam LGD; conduct 200pcs samples trial in

Vietnam and review FAI & CPK result by 8/5 (DONE)

▪

SQE Sean QPA audit in Vietnam site, target complete 8/5 (DONE)

▪

Secure production stability/quality: Vietnam and Korea will both produce same quantities to

support NPI build. Target check point as below

o

First check point: DVT 1 (Sept 13), 200+pcs CPK review ( >1.33)

o

Second check point: DVT 2 (Dec 18), 200+pcs CPK review (>1.33)

•

GOE align the quantities need with ME/LCD supplier to provide A cover/OLED panel before PPE 4/11 to conduct bonding trial before DVT 1 (May/end) (Done)

•

TributoMTL, verified on DVT1 build on July/mid.Result:Passed

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E2E Safe Launch KPI Goals

KPICategoryKPIMetricDVT1DVT2EngregPilotPVTMPSupply Predictability

RTY %Goal32.1%43.7%55.1%55.1%62.7%62.7%ActualPSCSR/Y/GR/Y/GR/Y/GR/Y/GR/Y/GR/Y/G

Process/ProductStability

FPYGoal81.10%85.50%91.60%91.60%94.20%96.70%ActualOBEGoal95.00%97.50%98.50%98.50%100%100%ActualTest CvrgGoal

70%

90%100%100%100%100%ActualOrder accuracyGoal---Jan22---May 20100%100%Actual---UPH Goal------60120120Actual------

Clean Launch

FRCGoal---------Jan30------Actual---------------XLTGoal---------------7dActual------------MSBDGoal------------100%100%Actual------------EGHGoal------------00Actual------------RTSGoal------------June 14---Actual---------------Order DL%Goal------------100%100%Actual------------Shuttle%Goal------------100%100%Actual------------FGIGoal------------14DN/AActual------------RTOGoal------------N/ATBDActual------------

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ME Safe Launch Goals

•

Leverage Tributochassis, all ME parts can meet 60% RTY goal.

Key Message

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DFMAA Summary

Key MessageOverall DFMAA status

•

DFMAA Compliance Status:

Green

•

MU Goal: 85%, Actual Score:

94.4%

•

Plan Phase mockup review and TributoMTL DVT1 DFMAA review completed, 17 identified, 3 will verify in DVT1 and 14 closed.

Top DFMAA issues & corresponding mitigation plans

1.No ESD protection on OLED Panel EE board, risk to cause on board short/damage and ESD. Result

passed

TributoMTL DVT1

.

Next step DMFAA plan:

•

Keeping tracking for DFMAA solutions and verify in DVT1.

CompliantNot compliant, action plan in placeNot compliant, insufficient action plan in placeStart tracking in early stage (RFI, RFQ, BA)

Mockup/EVTDVT1DVT2TLB/PPAPTOTAL17---

Open0

---

Verify3

---

Close14

---

DFMAA issues identified

DFMAA compliance

Note: issue count refer to what was identified at that build stage only, not cumulative from previous

DFMAA compliance status

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Recommendation

•

Approve

Process exceptionNext step

•

N/A

•

N/A

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Backup

ItemAttachmentRemark

MOQ

Manufacturing planNUDDDecorativeFinishes (ID) / color matrix planMdiag(TRD)Process CapabilityN/ANo risk for L10 process. Subtler process risk input to MEPG NUDD

DFMAAtracker

Packaging PlanME phase Gate# 2 &T1-T2 Supply Chain MapOrderProcessingTCA(Test Coverage Analysis)TA(Tolerance Analysis)

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Back up

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DFMAA Key Issue

8Confidential

Key Issues/observation Actions RequiredDFMAA

•

Smaller the adhesive area and conduct RSV testing by Aug/End and delivery samples to ODM for tear down simulation. ( Sept/Mid)Repair: KB board and TP board might be damage after tear down from palmrestdue to the large area of adhesive tape.Repair: The adhesive use on Mic potentially cannot be re-use after disassemble

•

Reduce the adhesive area and samples deliver to MFG by 8/17 for tear down verification.Solution in place and validatedSolution in place and pending validationNo solutionThe PPID was implemented on MB mylar release tape; After remove hard to track if quality concern

•

Aligned with ME to add the PPID mark on the mylar not release tape, this will implement on DVT1 (9/13)

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TributoQC Goal Vs TributoActual RTY

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Manufacture capability to support Qualcomm platform

Function

TaskTask description Function in charge

BiosNetwork boot server use for X64: PXE server *Additional note: Engineer/GTS is seeking the chance to use the same PXE server for ARM64PXE server will be use when device first boot up in MFG to dowload the OS image from the server *ODM: IPXE client to connect to PXE server *Dell factory: Remb client to connect to PXE serverBios team (Vic)Network boot server option HTTP server.*This is under assessment if PXE cannot support for MFGHTTP is an alternative option for new server setup. The methodology works the same as PXE but really technology field. BIOS DPFBioSDell provided feature Bios team (Vic)-MFG MODEThe manufacturing mode use to support the time systems spend on the assembly lines. -AttributesThe attributes is to get/set general Bios information inside platcfg. Such as: Bios version/manufacturere/release date/serial number/system

name/features….

etc-SMBIOS tableIt describe platform components and features -A3 functionsBios / test interface WMI library behavior stated to support bios features (Fan/ battery/thermal/adaptor..etc)-Common UEFI BIOS behaviorsIt is Unified Extensible Firmware interface. Benefit: support driver size/faster boot time/secure boot-EC behaviors (BBCL etc)EC communicate to key features (such as finger print reader, Fan, touch

function row, trackpad…

etc)DelldiagWBDDWindow base diagnostic design use to create testing tool for manufacture. This activity will include Bios to support WMI library and driver engineer to combine the infrasturework and provide to WBDD for test tool creation WBDD (Carl Andreason)-Remove SMI dependency-Remove X64 CPU registers dependency-Convert to ARM64 editionIT (CDC/BCC)Network boot server use on RemboThis is only valid in Dell factory to enable network boot. Dell factory only support Remboso far.Dell IT (Adrian)MdiagsWBT process tools convert to ARM64 editionOverall WBT process: Quick test-->extended test-->final test-->burn rackMdig(Jonny Zhang)Factory (BCC, Fedex, ODM)If any SFCS SUT side tools, convert to ARM64 edition SUT information management system during production GOE FM/NPIDevice vendorsVendor ARM64 WinPE toolsThis is the supplier test tool to support platform featuresGTS & device engineering-QC WWAN/WLAN/AUDIO-EH for wireless-Fingerprint reader-Jacky for FPR-TPM-Forrest for TPM--

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Manufacture capability to support Qualcomm platform (1/3)


Risk Level: MediumNUDD item

:

Concern on security provision key readiness in production

•


•

SA security architect arrange a POC on Feb/2024

•

Secure boot key will implement in Bios and flash into Rom.

•

Process for ICC/BCC/service: Bios Rom Bin reflash can implement UEFI secure boot key

•

GTS team will support verify with lati seed proto at Mar/2023 period

•

Keep monitor for DVT1 on May/2024

•

PM escalate to QTI management level to seek for support to implement HDCP key into CPU FW when ship to Dell. If QTI deny on the support, mitigation plan as below.

•

CT is investigating the right function (owner) to purchase HDCP key for TributoQC. (This involve legal agreement)

•

CT/GOE/SQE will align for the HDCP key management process to distribute and well control in different factory before PPE (4/11)

•

GTS/SQE PCBA will align on the HDCP key implement process (tool) in PCBA level before DPE (1/17)*ODM manage process

•

Used Warlock NQ process to tight the key in MES system and use Qualcomm tool to auto flash in BFT level.

•

Once above aligned will sync up with outsource PCBA assembly on Brazil/India region before PPE April/2023)

Contingency: 1. Only support L6 production (No L3 support) 2. Drop Dell factory


•

UEFI secure boot key PK(platform key /DB (whitelist database /DBK (blacklist database) not compatible for ARM64

•

The complexity to manage HDCP (High bandwidth digital content protection) key with ICC/BCC/repair on unclear ownership.(Risk: key re-use/key management up-to-date/key request)

ODM manage and purchaseClosed

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Risk Level: MediumNUDD item

:


•


•

Warlock NQ, first used QTI chipset and confirm the DRM implement process (Done)

•

Engineer confirm to put DRM key into SWB# and flash into SPIROM. (Done)

•

SQE PCB/ GTS aligned the used of QTI test tool with

written automate script in “Fuse” step for ODM factory. •

Support key implementation for DVT build on May/2022

•

CT under confirm if TPM a POR before DPE (1/17)

•

If POR, engineer will support to run a POC before Mar/2023

•

Create SWB# for TPM and conduct in L10 SWDL station

•

GTS support to verify engineer process before April/2023 in CDC lab


•

Concern to implement DRM (Digital right management) key by using QTI tool

•

TPM (Trust platform module) key provision readiness in MFG process

Not in POR scopeClosed

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Risk Level: LowNUDD item

:


•

Concern on supplier test tool readiness to support production

•

GoodixSupplier provide test tool under Winpeenvironment before April/2023 for GTS to verify.(Done)

•

WBT support with test for Dell factory

•

Engineer/GTS align on the wifi/antenna measurement spec before DPE (1/17) (Done)

•

GTS/Engineer align on the wireless manufacture test setup before DPE (1/17) (Done)

•

Supplier QTI provide test tool for GTS to verify April/2023 in CDC lab (Done)

•

Monitor from DVT1 onward 9/22

•

Engineer/GTS align the calibration method before DPE (1/17); (Case 06343169) (Done)

•

GTS/engineer/supplier aligned on the build verification test tool criteria that need to support under Winpeenvironment before DPE (1/17); (Case 06317609) (Done)

•

Supplier test tool verify in CDC lab on April/2023 (Done)

•

Keep Monitor DVT1 9/22


•

Finger print test tool (WBT)readiness to support under Winpeenvironment.

•

Build verification test

•

Function test

•

New Qualcomm Wifi(WBT) solution to provide test tool under WINPeenvironment

•

Build verification

•

Connectivity test on wireless module

（

WBT)

•

New ambient light sensor WBT test tool readiness under Winpeenvironment.

•

Build verification

•

Calibration data

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Second Source TouchPadenablement 1/2




Concern on Laibo

enablement to support second touchpad

•

Concern on Laiboenablement to support second touchpad

•

Concern on supplier side to provide semi-module meeting UX performance spec.

•

Engineer and Laiboaligned on the measurement specifications

for piezo quality, specifically capacitance and impedance tests. Target Oct/beg2023

•

Engineer, SQE, and Laiboaligned on the semi-module assembly process with the following activities: Target (Sept/beg 2023)

•

PCBA bonding to Touchpad Glass parameters to be

defined

•

Piezo bonding method to PCBA (parameters and fixture)

•

Semi-module assembly to Palmrest(fixture) to be definef

•

Engineer/SQE and Laiboalign for Semi-module testing. Target (Sept/beg 2023)

•

PCBA with AOI inspection define

•

LCR (Inductance,Capacitance,Resistor) equipment measurement spec define for Piezo quality

•

Touch pad semi-module Z-heigh measurement define to prevent the impact of Piezo performance.

•

Semi module vibration and force test define to ensure the quality of piezo

•

UX performance testing by using BELT after assembly to Palmrestfixture

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Second Source TouchPadenablement 2/2




Concern on Laibo

enablement to support second touchpad

•

Concern on Laiboenablement to support second touchpad

•

Concern on ODM manufacture readiness before Intel MTL DVT2 build

.

.

•

IQC: Semi-module inspection method to be defined by Sept/beg 2023

•

Engineer/ODM/supplier, Semi module inspection method on Z-height measurement, Target Sept/beg 2023

•

Might potentially impact semi-module functionality.

•

Egnineer/ODM/supplier, Semi-module testing method to be defined by Sept/Beg 2023

•

LCR meter measurement to be defined and also the equipment purchase lead time.

•

Functionality / UX performance testing method to be defined and the testing fixture lead time.

•

Engineer/ODM, align the bonding parameter for semi-module to Palmrestsept/late 2023

•

Request 3-5 samples to manufacture site and fine-tune the bonding fixture

•

Monitor DVT2 build on Intel MTL (Oct/2023)

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Camera test tool enablement under Winpeenvironment



:

Camera test tool enablement under Winpeenvironment

•

Supplier capability to support camera test tool under Winpeenvironment

•

Engineer under alignment with Qualcomm on calibration method for proximity sensor before DPE (1/17)

（

Done)

•

GTS/Engineer/supplier under test tool (WBT) alignment with different approach and will have plan before DPE (1/17)

•

QTI support to provide test tool on build verification for WBT (Case 06319135)

（

Done)

•

ODM created SWB# for camera test tool and validate using EVT sample. Target Aug/mid Done)

•

Keep monitor DVT1 9/22


•

Camera test tool (WBT) readiness to support under Winpeenvironment

•

Build verification test

•

Calibration

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Audio test tool enablement under Winpeenvironment



:

Audio test tool enablement under Winpeenvironment

•

Supplier capability to support audio test tool under Winpeenvironment

•

Engineer confirmed the audio codec is part of SOC QTI 8380XP to support audio function/performances (Done)

•

GTS/supplier QTI under alignment on Audio function support under WinPE environment before DPE (1/17); (Case 06307856)

（

Done)

•

ODM created SWB# for audio test tool and validate by Aug/mid

•

Monitor DVT1 build on 9/22.


•

New Qualcomm audio (WBT)solution to provide test tool under WINPE environment

•

DMIC function test

•

Speaker function test

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New Qualcomm CPU 8380XP



: New

Qualcomm CPU 8380XP

•

New Qualcomm CPU 8380XP CPU use on TributoQC with PCBA quality concern

•

Potential low yield rate on SMT

•

Engineer target to provide Qualcomm 8380 datasheet by Oct/End and will review with SQE before CPE (11/15)

Done

•

SQE reference Qualcomm 8180 CPU (Warlock NQ) DVT build progress and determine any validation coverage need for 8380 CPU (TributoQC) before DPE (1/17)

Done

•

Engineer/SQE will align on necessary add for AOI/X-ray/ICT test coverage after BA . (3/25)

Done

•

Keep monitor the build from EVT onward andrequest 100% inspection on AOI/ICT. Owner: SQE/GOE


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Qualcomm on board Wlanmodule (WCN7851)



:

Qualcomm on board wireless module (NCM825A)

•

WCN7851 is new on-board WLAN for MFG, concern on quality issue with parameters not yet optimize

•

Concern on MFG yield rate concern on soldering risk and warpage after SMT process.

•

Wlanmodule size enlarge to (16*20mm); Tributo(16*12mm)

•

4 rows of pad increase might potential cause soldering risk

•

PCB SQE/supplier CTQ review and 100% inspection before Feb/2023

(Done)

•

PCB gold layer thickness spec control

•

Wlanmodule soldering inspection

•

Warpage inspection

•

Wlanmodule cleaning control and inspect

•

PCB SQE/supplier collaborate on stencil opening review before EVT March/2023

(Done)

•

Solder paste spec

•

Reflow temperature

•

Keep monitor the build from EVT onward andrequest 100% inspection on visual inspection/ AOI/ICT. Owner: SQE/GOE

•

Additional inspection: 10pcs X-Ray FAI on each build

•

EVT/DVT1 build conduct 1 pc X-section and dye and pre test

Extra row with component (Increase pad size)Current Pad: 16*12mm

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Cosmetic issues of CNC-S D base (Leverage Tributo)



Risk Level:

Low

NUDDItem:

Cosmetic issues ofCNS-S

•

Challenge to hit ID requirements of cosmetic (oxidation spot, visible dent mark and over-polish)

•

LL: D door deformation that caused PSCS failed on hinge area

•

AL 5252 substrate with nano BB is difficult to hide scratch/dent/polish/sander/cutter mark etc.

•

LL:D door deformation spec was not defined in 2D drawing that caused PSCS fail with C/D step

•

SQE check the current average RTY 65% and Goal 62% (Fuyu/Dazhi) on D door and will check enhancement process to see opportunity to optimize RTY (Fine tune stamping and Post stamping process) before PPE (8/17) Done

•

SQE/CMF/ID confirm if we can leverage Tributolimit samples for criteria use on TributoQCbefore PPE. (8/17)

•

Engineer provide TA and ensure deformation spec add in as CTF in 2D spec before DPE (1/17) Done

•

Engineer/SQE align CTF measurement SOW after Tooling release + 2 weeks (4/27) Done

•

SQE check the 3D scan GR&R and 3.5mm go/no-go fixture will apply for TributoQC before CPE (11/15) Done

•

SQE review Tooling samples and conduct 3 pcs FAI measurement before DVT1 samples build (estimate Sept/beg 2023)

•

ME/SQE will align CTF lower limit and upper limit samples for assembly to validate best/worst scenario PSCS (3 ~5 units)

Dent markOver-polish

PSCS failed: C/D step

Go/no Go fixture for D door measurement

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C/D assembly method to prevent scratch (1/2)

Install 3 plastic holder (3 locations)

1

2

Assemble D cover

3

Remove plastic holder (3 location)

4

Assemble rear snap

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C/D assembly caused scratch (2/2)


Mitigation Plan

Risk EventRiskDriver

Risk Level:

Low

NUDDItem:

C/D cover assembly scratch

•

LL: In Tributo, C/D cover assembly scratch

•

LL: C and D parts are using aluminum material and during assembly process the sharp edge will potentially cause scratch

*D cover mitigation plan on slide 16

•

New C cover, aesthetic concern ID not agreed to add on the round edge angle > 0.25mm.(Done)

•

New C cover for TributoQC, ME conduct TA analysis and PSCS review before DPE (1/17) (Done)

•

ME/SQE align the CTF and review with supplier after BA(3/25) (Done)

•

ME/SQE review the DFM with supplier before PPE (8/17)

•

ME review if the plastic holder needed for TributoQC or it can be removed due to new tooling before PPE (8/17)

•

ME under discussion with supplier to have the plastic slider idea insert on the protection film

•

ME/SQE review measurement method with supplier tooling release + 2 weeks (estimate beg/May)(Done)

•

SQE review CTQ and RTY goal with supplier before PPE (8/17),

•

Tributo:Full CNCRTY 78% (Risun/Catcher)

•

SQE request supplier to provide upper limit/ lower limit 3 ~5 pcs for DVT1 build and execute in MFG PSCS system check.

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LL: Panel

peeling off from A cover risk



Risk Level:LowNUDDItem:

Panel peeling off from A cover risk

•

Customer returns caused by Panel peeling off from A cover

•

Concern on the supplier (catcher) material control that caused panel peeling off

•

Raw material time to time audit process should conduct in Catcher, check on the audit process and timeline with SQE before PPE.(8/17)

•

Storage condition

•

A cover surface contamination

•

To improve remote audit and FAI governance process to ensure sufficient validation coverage by PPE (8/17), AI: SQE.

•

ODM failed to ensure proper rework process in the factory

.

•

To eliminate SUB line offline repair, only Central repair area with MES control and keep traceability on repair record before DVT, AI:ENG/GOQ

•

Conduct monthly quality culture promotion and PCR execution audit by Eng/GOQ

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Exception

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LGD 3K OLED supplier capability concern (P-RTS)

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ProcessProcess readiness

LTPSMP for Mobile productNew to DellTandem OLEDTouch on encapsulation)Optical/Mura compensation

New Tech. Introduction (Tandem OLED)

Background:

•

LGD is planning to introduce OLED which has not been used in Dell for Triburo QC.

•

Current LGD OLED processes are optimized for mobile but not been used for notebook. NBPC OLED product and process need to be set up and verified with actual samples. -

Triburo QC DPE : ‘ 23 Jan 17

th

. -1

st

OLED Sample schedule: ’23. March

-

MRL 5 exit target : ’23 July (before DVT1.1)

Phase gate

TributoQCBuild

LGD Schedule

DPEPPE

DVT1.1 OLED module arrive CKS

DVT2 system buildP-RTSEVT

1/174/114/153/22

MRL4 Exit

8/810/5

MRL5 exit7/21

DVT2 OLED module arrive CKS

12/13

DVT1.1 system build

8/16

EngRgrsystem build

10/13

EngRgrOLED module arrive CKS

Jan -March

12/5

Apr 24Qual Jan 24/beg

Supplier mock up reviewSupplier reliability

April -July

Supplier reliability testSupplier regression test

Aug/End -Sept

Supplier regression test

Oct/End -NovDec/End

–

Jan/end

MP panel arrive

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New color: Anodize Azurite for TributoQC (XPS/Latitude)



Risk Level: MediumNUDDItem:

New color: Anodize Azurite for TributoQC (XPS/Latitude)

•

Concern on new color Azurite cosmetic issue, and impact schedule

•

Concern on the supplier production yield rate to observe anodize defects on dis-color on parts A/C/D

•

Concern on the Impact of the schedule

•

Supplier provides samples to CMF team to sign off color plaque and define B2 color value for CPK measurement (Before DVT1.0)

•

Anodized schedule: Color chip ship to ADC by 5/12 and target provide feedback 6/3

•

Bumper resin color chip ship to ADC by 5/22 and target provide feedback 6/3

•

Plastic ribs for palmrest, color chip ship to ADC by 5/5 and target provide feedback 5/8

•

Each supplier conduct 50pcs samples trial to gather dis-color data and to optimize anodize process parameter before DVT1.0

•

Color fine-tune by using Tributomechanical parts

•

SQE review supplier color CPK >1.0 on lower/upper limit (color/gloss/thickness) and review DVT 1 build result (100% measurement)

•

Base on DVT1 build result to optimize anodize parameter and if color CPK<1.0, conduct a 20~ 30pcs trial run before DVT2.

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WWP

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TributoQC Plan

Phase Exit

WWP

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TributoQC PPE WWP Status is Green

Overall Status: GreenRecommendation:

•

Approve PPE but continue tracking follow up items.

Follow up actions:

•


•

SchMfollow up SSS 2

nd

source progress after DVT1.0

•

Tracking transition plan at T-24 and UPP/MBP/MRP loading on time

Plan PhaseStatusRemarkIdentify WWP extended team (GSM/GCM/GBP)GIdentify suppliers/risks/optionsGTarget Costs SetGContract negotiationsGBusiness Contract AdherenceGIdentify Suppliers/risks/options : GComplexity ReductionGWWP Functional PlanGExit Plan PhaseGWW Procurement - Supply Chain - Phase Review Checklist

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WWP Phase Gates Passed

Plan PhasePG/CPWWP Phase TrackerT-minusStatus/DuePGME/XLOB Component RFQ release & BAPPEDonePGCommodity ReviewPPEDonePGPPAP Schedule AlignmentPPEDonePGContract Book ReadyPPEDonePGIdentify critical part qualification schedulePPEDonePGComplexity ReductionPPEDonePGPost BA changes recordedPPEDoneCPCell GCM acquire costed BOMBA+1 monthDoneCPSend out program kick-off noteDPE+1 weekDoneCPCo-work with GOE for risk go tooling recommendationPPEDoneCPCollect supply chain map from ODMPPEDoneCPGet XLOB PORDDSDoneCPProvide cost estimate for contract bookBA+1 weekDoneCPReceive BA XLOB PORPPEDoneCPXLOB BA quote by DDS+4 weeks and complete PPE costPPEDone

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Tooling Plan

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Tooling ME Plan/readiness update

1

•

All ME parts leverage MTL.

•


•

C-Cover/QHD/FHD A cover PPAP sets on 12/2/23 (Leverage TributoMTL schedule)

•

OLED A cover PPAP set on 1/8/24, leverage TributoMTL schedule.

•

Bottom Bezel and D cover are leveraged with predecessorTributoRPL/ADL/MTL

Key Tooling PartMaterialOwnerEIV candidate

FHD/QHD/OLED A-cover (Magnetite/Light Gray)AL Extrusion + CNC + Anodized + IMDGPCatcher/RSC-cover (Magnetite/Silver)AL Extrusion + CNC + BeadblastDGPCatcher/RS

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Supply Chain Map

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2

Supply Chain Map (Magnetite + Silver)

C Cover(AL CNC + Beadblast)D Cover(Forge Stamping)

CKS

BTM Bezel (SUS)(WLED SKUOnly)

Tooling HouseCatcher / RiShanTooling HouseDazhi/ CNPCover LogoCNP / Cymmetrik

A Cover(AL CNC + IM + Anodized)

LCD Cover Assy

Catcher / RiShanTooling HouseCatcher / RiShanPalmrestAssyCatcher / RiShanTooling HouseFuyu/ ChunqiuD-Cover Assy

Fuyu/ Chunqiu

BTM Bezel Assy.Dazhi/CNP

Cover Logo

CNP / Cymmetrik

Hinge

SZS / SNR / JarllyCable CoverMitac/ YURONG

Leverage with previous gens

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Single & Sole Source Summary

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L10 Single Sole Summary

3

•

EVT multiple source ratio is 78.1%.will have further test result in NPI (In RTS, 10 out of 32 are leveraged with TributoMTL)

•

Rubber Foot: keep seeking for ENG/SQE continuous support for 2nd source qualification

•

Single Source Mitigation plan: follow SSS mitigation plan

Tributo QCEVT(Plan)RTSEESingle/Sole Source9332MESingle Tooling/Vendor10Commodity/Other Single/Sole Source109Single/Sole TTL10441Multiple TTL371434EE Single %19.6%6.7%ME Single %0.2%0.0%Commodity/Other Single %2.1%1.9%Multiple Source %78.1%91.4%

19.6%0.2%2.1%78.1%

Tributo QC SSS percentage

EE Single %ME Single %Commodity/Other Single %Multiple Source %

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AVAP/DGP Parts & Mitigation Plan

4

▪

Based on L/T to do strategy preparation for new & unique AVAP/DGP parts

TypeDescription/VendorOwnerShared Platform in CompalSourceL/T

CPUsSC8380XP/QualcommDGPThenaNQSole24

WLAN 99H465.01/FoxconnAVAPThenaNQSole28

SSD

512GB/1TB/2TB (Gen. 4)

DGPCommon(TributoMTL)Multiple13(Kioxia/Hynix/WDC/Micron/Samsung)LPDDR5XLDR5X 16GB/32GB ((Samsung/Micron/Hynix) LDR5X 64GB(Samsung/Micron/Hynix)DGPCommonMultiple13Battery800Whr/L Bat (Simplo/BYD)DGPUnique(leverage with TributoMTL)Multiple13

Panel -1FHD NTS+ LCD (Sharp/(LGD)DGPCommon(TributoMTL)Multiple13

Panel

–

2QHD TS LCD Module (Sharp/LGD)DGPCommon(TributoMTL)Multiple13Panel -3OLED TS LCD Module (LGD)DGPCommon(TributoMTL)Sole13Keyboard(Darfon/Chicony/Liteon)AVAPUnique(leverage with TributoMTL)Multiple17FHD CameraCamera Module (Luxvisions/Chicony)AVAPUniqueMultiple34

FPRFPR (JYT/AOET)AVAPCommon(TributoMTL)Multiple24

Caps Touchpad PCBATP Module (ELAN)AVAPUniqueSole18Haptic Module/ SensorAitoAVAPUnique(TributoMTL)Sole18Adaptor (60W)Adaptor (Delta/Liteon/Chicony)AVAPCommon(TributoMTL)Multiple20PowerCordPowerCord(Longwell/SLT)AVAPCommon(TributoMTL)Multiple13

Fan (L)FAN (Delta/SUNON)DGPUnique(leverage with TributoMTL)Multiple15Fan (R)FAN (Delta/SUNON)DGPUnique(leverage with TributoMTL)Multiple15

Thermal ModuleThermal Module (CCI/SUNON)DGPUnique(leverage with TributoMTL)Multiple15SpeakerSpeaker (FG/VECO)AVAPCommon(TributoMTL)Multiple9Touch Function RowELAN/Darfon-plan by RTSAVAPCommon(TributoMTL)Multiple18

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Backup WWP

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Risk buy

assessment

-

Identified LLT unique parts

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Risk buy assessment

-Identified LLT unique parts

Milestone

MilestoneDate (POR)T minusRTS

6/14/2024

BA

6/21/2023

PPE

8/17/2023T-43

UPP

1/26/2024T-20

Tributo QC XPSPart catogoryDescriptionLT (wk)Cost/sysPO coverage (monthly)Approval reqeust dateBC/monthTTL amount

CPUNuvia10C/12C 24$ 320.00 1.5 T-2513,389 $ 6,426,667 ICMPS, NXP, PERICOM, Toshiba, ON (7)> 28$ 2.46 9.0 T-36 (PPE)13,389 $ 296,671 Qualcomm, Murata, TI (19)<= 28$ 25.88 3.0 T-3013,389 $ 1,039,473 NA< 20

WIFIFoxcon(Qualcomm selected)28$ 12.00 3.0 T-3013,389 $ 482,000

TTL$ 8,244,811

CPU/WLAN/Unique LLT IC

–

risk buy assessment

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Tooling List

1

▪

Total 34 copy tooling and 12 new tooling parts. 34 copy tooling parts and 6 new tooling parts could leverage with TributoMTL.

PartsMtlOwnerattach ratedemand volumevendor candidateTooling Sets in PPAP(QC+MTL)

IDP30_LCD_COVER_BLK_OLED

Metal DGP20%125,100 Catcher/Rishan2

IDP30_LCD_COVER_GRAY_OLED


IDP30_LCD_COVER_BLK(QHD+ FHD)


IDP30_LCD_COVER_GRAY(QHD+ FHD)


GDO31_LCD_BTM_BEZEL

Metal EM50%312,750 Dazhi/ CNP2

GDO31_LCD_CABLE_COVER_BLK

plastic EM40%250,200 Mitac / YURONG 2

GDO31_LCD_CABLE_COVER_GRAY


GDO31_LOG_UP_EDP_HOLDER


GDO31_LOG_UP_KB_PLATE_L

Metal EM100%625,500 SINO/JINGYIJIE2

GDO31_KB_BEZEL_FRONT_BLK


GDO31_KB_BEZEL_FRONT_GRAY


GDO31_KB_BEZEL_REAR_BLK

plastic EM40%250,200 Mitac/ YURONG 2

GDO31_KB_BEZEL_REAR_GRAY


GDO31_LOG_LOW_BLK_PAINTING

Metal DGP40%250,200 Fuyu/ Chunqiu/Mitac2

GDO31_LOG_LOW_RUBBER_FOOT_F_2-2_BLK

plastic DGP40%250,200 DAZHISZ/CHENGTIAN2

GDO31_LOG_LOW_RUBBER_FOOT_R_2-2_BLK


GDO31_LOG_LOW_RUBBER_FOOT_F_2-2_GRAY


GDO31_LOG_LOW_RUBBER_FOOT_R_2-2_GRAY


GDO31_LOG_LOW_SNAP_R


GDO31_LOG_LOW_SNAP_L


GDO31_LOG_LOW_SNAP_FRONT_C


GDO31_LOG_LOW_VENTING_R


GDO31_LOG_LOW_VENTING_L


GDO31_LOG_LOW_FRAME_BLK


GDO31_LOG_LOW_SNAP_BACK_R


GDO31_LOG_LOW_SNAP_BACK_L


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Tooling List

2

▪

Total 34 copy tooling and 12 new tooling parts. 34 copy tooling parts and 6 new tooling parts could leverage with TributoMTL.

PartsMtlOwnerattach ratedemand volumevendor candidateTooling Sets in PPAP(QC+MTL)

GDO31_LOG_LOW_MESH_RMetal EM100%625,500 SINUOXING/HEXIN2 GDO31_LOG_LOW_MESH_LMetal EM100%625,500 SINUOXING/HEXIN2 GDO31_LOG_LOW_MESH_REAR_WITH_ADHESIVEMetal EM100%625,500 SINUOXING/HEXIN2 IDP30_MB_SUPPORT_BRACKET_RMetal EM100%625,500 SINO/JINGYIJIE2 GDO31_MB_SUPPORT_BRACKET_LMetal EM100%625,500 SINO/JINGYIJIE2 GDO31_BATT_CONN_BRKMetal EM100%625,500 SINO/JINGYIJIE2 GDO31_EDP_BRKMetal EM100%625,500 SINO/JINGYIJIE2 GDO31_TYPEC_BRK_LMetal EM100%625,500 SINO/JINGYIJIE2 GDO31_FPR_BRKMetal EM100%625,500 SINO/JINGYIJIE2 GDO31_THM_SSD_PLATEMetal EM100%625,500 BINGRONG/Mitac2 GDO31_2230_SSD_BRKMetal EM100%625,500 BINGRONG/Mitac2 IDP30_LOG_UP_KB_PLATE_RMetal EM100%625,500 MPT/SINO/BINGRONG/KIPO/JINGYIJIE2 IDP31_LOG_UP_KB_PLATE_REARMetal EM100%625,500 MPT/SINO/BINGRONG/KIPO/JINGYIJIE2 IDP31_LOG_UP_KB_PLATE_FRONTMetal EM100%625,500 MPT/SINO/BINGRONG/KIPO/JINGYIJIE2 IDP30_THM_EDP_BRK_RMetal EM100%333,000 MPT/SINO/BINGRONG/KIPO/JINGYIJIE2 IDP30_THM_EDP_BRK_LMetal EM100%333,000 MPT/SINO/BINGRONG/KIPO/JINGYIJIE2 IDP30_TYPEC_BRK_RMetal EM100%333,000 MPT/SINO/BINGRONG/KIPO/JINGYIJIE2 IDP30_MB_SHIELDING_FRAMEMetal EM100%666,000 MPT/SINO/BINGRONG/KIPO/JINGYIJIE3 IDP30_WLAN_BRKMetal EM100%333,000 MPT/SINO/BINGRONG/KIPO/JINGYIJIE2 IDP30_MB_SHIELDING_COVERMetal EM100%666,000 MPT/SINO/BINGRONG/KIPO/JINGYIJIE3

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L10 Single Sole List (1/6)

3

CategoryComponentsSingle/Sole sourceDPN/ODM PNDescriptionManufacturer/SupplierType(DGP/AVAP/ODM)UniquenessUsageLT (week)SSS Risk Level(H/M/L)Multiple source plan (Y/N)Target qualification timelineJustification on not qualifying multiple sourceMitigation planNew to Dell(Y/N)

CommodityCPUSA0000GC71LS IC SC8380XP NSP 2127 SQualcommDGPProgram Unique1TBDMNN/ANo pin-to-pin 2nd source. Qualcomm CpuKeep 40 days DSIYEEICSole sourceSA0000G1100S IC WSA-8845-0-WLNSP36D-TR-00-0 SPK AMPQualcommAVAPProgram Unique421MNN/ANo pin-to-pin 2nd source. Qualcomm Designated ICKeep 40 days DSIYEEICSole sourceSA0000FZQ00S IC PMK8380 FOWPSP 42P CLK GEN & DISTRIQualcommAVAPProgram Unique122MNN/ANo pin-to-pin 2nd source. Qualcomm Designated ICKeep 40 days DSIYEEICSole sourceSA0000G2910S IC PMC8380VE WLPSP 104P PMIC ES SQualcommAVAPProgram Unique122MNN/ANo pin-to-pin 2nd source. Qualcomm Designated ICKeep 40 days DSIYEEICSole sourceSA0000G2910S IC PMC8380VE WLPSP 104P PMIC ES SQualcommAVAPProgram Unique422MNN/ANo pin-to-pin 2nd source. Qualcomm Designated ICKeep 40 days DSIYEEICSole sourceSA0000G2A10S IC PMC8380C FOWPSP 110P PMIC ES SQualcommAVAPProgram Unique127MNN/ANo pin-to-pin 2nd source. Qualcomm Designated ICKeep 40 days DSIYEEICSole sourceSA0000G3F10S IC PMC8380 WLPSP 108P PMIC ES SQualcommAVAPProgram Unique222MNN/ANo pin-to-pin 2nd source. Qualcomm Designated ICKeep 40 days DSIYEEICSole sourceSA0000GBW00S IC SMB2360 MQFN 62P CHARGERQualcommAVAPProgram Unique220MNN/ANo pin-to-pin 2nd source. Qualcomm Designated ICKeep 40 days DSIYEEICSole sourceSA0000GG000S IC PMC1010H-0-WLPSP80-TR-01-0-02 PMICSQualcommAVAPProgram Unique220MNN/ANo pin-to-pin 2nd source. Qualcomm Designated ICKeep 40 days DSIYEEICSole sourceSA0000GG100S IC PMC1010H-0-WLPSP80-TR-01-0-06 PMICSQualcommAVAPProgram Unique220MNN/ANo pin-to-pin 2nd source. Qualcomm Designated ICKeep 40 days DSIYEEConnectorSingle sourceLTCX0099IA0S H-CONN CVILUX CF4208EH0RA-05-NH FFC SCVILUXODMIndustry Part18LYDVTNEEConnectorSingle sourceLTCX00A410LS H-CONN HRS FH58-41S-0.2SHW(07) FPC SHRSODMIndustry Part112LNN/ANo Pin to Pin solution.Keep 40 days DSINCommodityWLANPK29S00DM0LS_W/L_MOD FOXCONN T99H465.01 W/BT SFoxconnAVAPProgram Unique128LNN/AWLAN module sole source from Qualcomm and modualizedby Foxconn onlyStrategy DSIYEEICSingle sourceSA00003WY00S IC SN74LVC1G123DCUR VSSOP 8P MULTIVIBRTIODMIndustry Part126LYDVTNEEICSingle sourceSA00006U600S IC AOZ1336DI DFN 8P SINGLE LOAD SWAOSODMIndustry Part726LYDVTNEEICSingle sourceSA000079400S IC SY6288C20AAC SOT23 5P PWR SWSILERGYODMIndustry Part226LYDVTNEEICSole sourceSA000089W00S IC LNG2DMTR LGA 12P MOTION SENSORSTAVAPIndustry Part126LNN/ANo pin to pin 2nd source. Different solution needs to re-layout.Keep 40 days DSINEEICSole sourceSA00008I800S IC NB680GD-Z QFN 12P PWMMPSODMIndustry Part130LNN/ANo pin to pin 2nd source. Power solution no alternative part. Different solution needs to re-layout.Keep 40 days DSINEEICSole sourceSA000090100S IC PI6ULS5V9617AUEX MSOP 8P SMBUSPERICOMODMIndustry Part145LNN/ANo pin-to-pin 2nd source due to no suitable ENG spec in marketKeep 40 days DSINEEICSole sourceSA00009B500S IC FL 16M W25Q16JWZPIQ WSON 8P SPI ROMWINBONDODMIndustry Part113LNN/ANo pin-to-pin 2nd source due to no suitable ENG spec in marketKeep 40 days DSIN

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4


EEICSingle sourceSA00009CB00S IC TCS40DLR SOT-23F 3P HALL SENSORTOSHIBAODMIndustry Part126LYDVTNEEICSole sourceSA00009DY00S IC ECE1117-Y3-1-TR SQFN 48P KEYBOARDMICROCHIPAVAPIndustry Part152LNN/ANo pin to pin 2nd source. Different solution needs to re-layout.Keep 40 days DSINEEICSole sourceSA0000AX400S IC G516A1Y51U TSOT-23 8P PW SWITCHGMTODMIndustry Part214LYDVTNo pin-to-pin 2nd source due to no suitable ENG spec in marketYEEICSole sourceSA0000B0M00S IC RT9069-33GQU UDFN 6P LDORICHTEKODMIndustry Part120LNN/ANo pin-to-pin 2nd source. Under testing to see if will remove in MPKeep 40 days DSINEEICSole sourceSA0000BFY00S IC LIS2DW12TR ACCELEROMETER A31$STAVAPIndustry Part118LNN/ANo pin to pin 2nd source. Different solution needs to re-layout.Keep 40 days DSINEEICSole sourceSA0000BQQ00S IC SN75DPHY440SSRHRR WQFN DPHY RETIMERTIODMProgram Unique26LNN/ANo pin-to-pin 2nd source. Qcom designated retimer partKeep 40 days DSINEEICSole sourceSA0000BYE00S IC NB591GG

–

Z QFN 11P PWMMPSODMIndustry Part130LNN/ANo pin to pin 2nd source. Power solution no alternative part. Different solution needs to re-layout.Keep 40 days DSINEEICSole sourceSA0000C0100S IC MP2410AGJ-Z TSOT23 6P PWMMPSODMIndustry Part230LNN/ANo pin to pin 2nd source. Power solution no alternative part. Different solution needs to re-layout.Keep 40 days DSINEEICSole sourceSA0000CDF00S IC SY8843QWC QFN 7P CONVERTERSILERGYODMProgram Unique226LNN/ANo pin-to-pin 2nd sourceKeep 40 days DSINEEICSole sourceSA0000CQE00S IC AOZ1375DI-01 DFN 12P LOAD SWITCHAOSODMIndustry Part226LNN/ANo pin-to-pin 2nd sourceKeep 40 days DSINEEICSingle sourceSA0000CYO80S IC ST33HTPH2X32AHE4 VQFN 32P TPMSTAVAPIndustry Part126LYDVTNEEICSingle sourceSA0000DC400S IC AP7343D-28FS4-7B X2-DFN1010-4 LDODIIODMIndustry Part220LYDVTNEEICSingle sourceSA0000DGX00S IC AP7343D-18FS4-7B X2-DFN1010-4 LDODIIODMIndustry Part420LYDVTNEEICSole sourceSA0000DIF20S IC MEC5200M-D0-I/LJ WFBGA KB CTRL REVCMICROCHIPAVAPIndustry Part152LNN/ANo pin to pin 2nd source. Different solution needs to re-layout.Keep 40 days DSINEEICSingle sourceSA0000DNN00S IC AP7366-SN-7 U-DFN2020 6P LDODIIODMIndustry Part233LYDVTNEEICSole sourceSA0000EE930S IC PS8830BGA105GTR-A3 BGA USB4 RETIMERPARADEAVAPProgram Unique218MNN/ANo pin-to-pin 2nd source. Qualcomm Designated ICKeep 40 days DSIY

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5


EEICSole sourceSA0000G1A00S IC 7UL1T32FS SOT-953 5P CMOSTOSHIBAODMIndustry Part140LNN/ANo pin-to-pin 2nd source due to no suitable ENG spec in marketKeep 40 days DSINEEICSole sourceSA0000G3510S IC PTN3222DUKZ WLCSP 12P USB2.0 REDRIVNXPODMProgram Unique230MNN/ANo pin-to-pin 2nd source. Qualcomm Designated ICKeep 40 days DSIYEEPassiveSingle sourceSB000005F00S TR PDTA114EU PNP SC70-3 -DNEXPERIAODMIndustry Part135LYDVTNEEPassiveSingle sourceSB00000SI00S TR 2N7002KTB 1N SOT523-3 -DPANJITODMIndustry Part935LYDVTNEEPassiveSole sourceSB00000SS00S TR NTK3139PT1G 1P SOT723-3 -DONODMIndustry Part235LNN/ANo pin-to-pin 2nd source due to no suitable ENG spec in marketKeep 40 days DSINEEPassiveSingle sourceSB000017N00S TR PMDXB600UNE 2N DFN1010B-6 -DNEXPERIAODMIndustry Part1735LYDVTNEEPassiveSole sourceSB000017O00S TR PMDXB950UPE 2P DFN1010B-6 -DNXPODMIndustry Part135LYDVTNo pin-to-pin 2nd source due to no suitable ENG spec in marketKeep 40 days DSINEEPassiveSingle sourceSB00001WO00S TR AONR21305C 1P DFN3X3-8 -DAOSODMIndustry Part235LYDVTNo pin-to-pin 2nd source due to no suitable ENG spec in marketKeep 40 days DSINEEPassiveSingle sourceSB00001G700S TR DMG1012UW-7 1N SOT323-3 -DDIIODMIndustry Part135LYDVTNEEPassiveSingle sourceSB00001YW00S TR PJQ1916 1N DFN1006-3L -DPANJITODMIndustry Part235LYDVTNEEPassiveSingle sourceSC300001Y00S DIO(BR) AZ1045-04F.R7G DFN2510P10E ESDAMAZINGODMIndustry Part426LYDVTNEEPassiveSingle sourceSC40000AZ00S ZEN DIO AZ4A24-01F.R7G DFN0603P2YAMAZINGODMIndustry Part926LYDVTNEEPassiveSingle sourceSC40000BG00S ZEN DIO LUDZS3.6BT1G SOD-323-2LRCODMIndustry Part226LYDVTNEEPassiveSingle sourceSC40000GP00S ZEN DIO LNZ8F6V2T5G SOD882LRCODMIndustry Part226LYDVTNEEPassiveSingle sourceSC40000NF00S ZEN DIO AZ5A75-01F.R7G DFN0603P2YAMAZINGODMIndustry Part2226LYDVTNEEPassiveSingle sourceSCA00003W00S ZEN ROW PUSB3FR4 10P C/A DFN2510A-10NEXPERIAODMIndustry Part126LYDVTNEEPassiveSingle sourceSCA00004500S ZEN ROW CEST23NC24VU 3P C/A SOT23 BATTCREATEKODMIndustry Part226LYDVTNEEPassiveSingle sourceSCS00000Z00S SCH DIO RB751V-40 SOD-323PANJITODMIndustry Part226LYDVTNEEPassiveSingle sourceSCS00008A00S SCH DIO LBAT54HT1G SOD323-2LRCODMIndustry Part226LYDVTNEEPassiveSingle sourceSD000008J00S RES 1/20W 27 +-5% 0201YAGEOODMIndustry Part115LYDVTNEEPassiveSingle sourceSD000020M00S RES 1/8W 0.05 +-1% 0805 100PPMYAGEOODMIndustry Part115LYDVTNEEPassiveSingle sourceSD00002V400S RES 1/8W 0.08 +-1% 0805 100PPM/CYAGEOODMIndustry Part115LYDVTN

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2023.0817.b TQC - Plan Phase Exit - Final 8-11-23 - LPR Approved

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2023.0817.b TQC - Plan Phase Exit - Final 8-11-23 - LPR Approved

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