Embedded DRAM Components for device manufacturers

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Kingston DRAM components are designed to meet the needs of embedded devices and are available with low- voltage variants for reduced power consumption.

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Standard Part Numbers and Specifications

Part Number	Capacity	Description	Package	Configuration (Words x Bits)	Speed Mbps	VDD, VDDQ	Operating Temperature
D1216ECMDXGJD	2Gb	96 ball FBGA DDR3/3L	7.5x13.5x1.2	128Mx16	1866 Mbps	1.35V	0°C ~ +95°C
D2568ECMDPGJD	2Gb	78 ball FBGA DDR3/3L	7.5x10.6x1.2	256Mx8	1866 Mbps	1.35V	0°C ~ +95°C
D2516ECMDXGJD	4Gb	96 ball FBGA DDR3/3L	7.5x13.5x1.2	256Mx16	1866 Mbps	1.35V¹	0°C ~ +95°C
D5128ECMDPGJD	4Gb	78 ball FBGA DDR3/3L	7.5x10.6x1.2	512Mx8	1866 Mbps	1.35V¹	0°C ~ +95°C
D2516ECMDXGME	4Gb	96 ball FBGA DDR3/3L	7.5x13.5x1.2	256Mx16	2133 Mbps	1.35V¹	0°C ~ +95°C
B5116ECMDXGJD	8Gb	96 ball FBGA DDR3/3L	9x13.5x1.2	512Mx16	1866 Mbps	1.35V¹	0°C ~ +95°C
D1216ECMDXGJDI	2Gb	96 ball FBGA DDR3/3L I-Temp	7.5x13.5x1.2	128Mx16	1866 Mbps	1.35V	-40°C ~ +95°C
D2568ECMDPGJDI	2Gb	78 ball FBGA DDR3/3L I-Temp	7.5x10.6x1.2	256Mx8	1866 Mbps	1.35V	-40°C ~ +95°C
D2516ECMDXGJDI	4Gb	96 ball FBGA DDR3/3L I-Temp	7.5x13.5x1.2	256Mx16	1866 Mbps	1.35V¹	-40°C ~ +95°C
D5128ECMDPGJDI	4Gb	78 ball FBGA DDR3/3L I-Temp	7.5x10.6x1.2	512Mx8	1866 Mbps	1.35V¹	-40°C ~ +95°C
D2516ECMDXGMEI	4Gb	96 ball FBGA DDR3/3L I-Temp	7.5x13.5x1.2	256Mx16	2133 Mbps	1.35V¹	-40°C ~ +95°C
B5116ECMDXGJDI	8Gb	96 ball FBGA DDR3/3L I-Temp	9x13.5x1.2	512Mx16	1866 Mbps	1.35V¹	-40°C ~ +95°C
D5116AN9CXGRK	8Gb	96 ball FBGA DDR4 C-Temp	7.5x13x1.2	512Mx16	2666 Mbps	1.2V	0°C ~ +95°C

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