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Kingston Part Number Decoder

Learn how to read Kingston® memory part numbers including Kingston FURY™, Server Premier™, ValueRAM®, HyperX®, DDR5, DDR4, DDR3, DDR2, and DDR memory product lines to help you identify modules by specification.

Kingston FURY™ DDR5

The following information is designed to help you identify Kingston FURY Memory Modules by Specification.

Part Number: KF548C38BBK2-16

  • KF
  • 5
  • 48
  • C
  • 38
  • B
  • B
  • K2
  • -
  • 16
KF = Product Line
  • KF – Kingston FURY
5 = Technology
  • 5 – DDR5
48 = Speed
  • 48 – 4800
  • 52 – 5200
  • 56 – 5600
  • 60 – 6000
C = DIMM Type
  • C – UDIMM
  • S – SODIMM
38 = CAS Latency
  • 38 – CL38
  • 40 – CL40
B = Series
  • B – Beast
  • I – Impact
B = Heat Spreader
  • B – Black
K2 = Kit + no. in kit
  • Blank – Single Module
  • K2 – Kit of 2 Modules
16 = Total Capacity
  • 16 – 16GB
  • 32 – 32GB
  • 64 – 64GB

DDR5 ValueRAM

Part Number: KVR48U40BS8LK2-32X

  • KVR
  • 48
  • U
  • 40B
  • S
  • 8
  • L
  • K2
  • -
  • 32
  • X
KVR = Kingston ValueRAM
  • KVR – Kingston ValueRAM
48 = Speed
  • 48 – 4800
  • 52 – 5200
  • 56 – 5600
  • 60 – 6000
U = DIMM Type
  • U – DIMM (Non-ECC Unbuffered)
  • S – SO-DIMM (Non-ECC Unbuffered)
40B = CAS Latency
  • 40 – 40-40-40
  • 40B – 40-39-39
  • 42 – 42-42-42
S = Ranks
  • S – Single Rank
  • D – Dual Rank
8 = DRAM Type
  • 8 – x8 DRAM chip
  • 6 – x16 DRAM chip
L = Profile
  • Blank – Standard
  • L – Very Low Profile (VLP)
K2 = Kit + Number of pieces
  • Blank – Single Module
  • K2 – Kit of 2 Modules
  • K4 – Kit of 4 Modules
32 = Capacity
  • 8 – 8GB
  • 16 – 16GB
  • 32 – 32GB
  • 64 – 64GB
  • 128 – 128GB
  • 256 – 256GB
X = Customization
  • Blank – Standard Pack
  • BK – Bulk Pack

Kingston FURY™ DDR4/DDR3

Part Number: KF432C16BB1AK4/64

  • KF
  • 4
  • 32
  • C
  • 16
  • B
  • B
  • 1
  • A
  • K4
  • /
  • 64
KF = Product Line
  • KF - Kingston FURY
4 = Technology
  • 3 - DDR3
  • 4 - DDR4
32 = Speed
  • 16 - 1600
  • 18 - 1866
  • 26 - 2666
  • 29 - 2933
  • 30 - 3000
  • 32 - 3200
  • 36 - 3600
  • 37 - 3733
  • 40 - 4000
  • 42 - 4266
  • 46 - 4600
  • 48 - 4800
  • 50 - 5000
  • 51 - 5133
  • 53 - 5333
C = DIMM Type
  • C - UDIMM
  • S - SODIMM
16 = CAS Latency
  • 9 - CL9
  • 10 - CL10
  • 11 - CL11
  • 13 - CL13
  • 15 - CL15
  • 16 - CL16
  • 17 - CL17
  • 18 - CL18
  • 19 - CL19
  • 20 - CL20
B = Series
  • B - Beast
  • R - Renegade
  • I - Impact
B = Heat Spreader
  • Blank - Blue
  • B - Black
  • R - Red
1 = Revision
  • Blank - 1st Revision
  • 1 - 16GB module(s) with 1Gx8 (8Gbit) components
  • 2 - 2nd Revision
  • 3 - 3rd Revision
A = RGB
  • Blank - Non-RGB
  • A - RGB
K4 = Kit + no. in kit
  • Blank – Single module
  • K2 - Kit of 2 modules
  • K4 - Kit of 4 modules
  • K8 - Kit of 8 modules
64 = Total Capacity
  • 4 - 4GB
  • 8 - 8GB
  • 16 - 16GB
  • 32 - 32GB
  • 64 - 64GB
  • 128 - 128GB
  • 256 - 256GB

HyperX® Part Number Decoder

The following information is designed to help you identify Kingston HyperX Memory Modules by Specification.

Part Number: HX429C15PB3AK4/32

  • HX
  • 4
  • 29
  • C
  • 15
  • P
  • B
  • 3
  • A
  • K4
  • /
  • 32
HX = Product Line
  • HX - HyperX (Legacy)
4 = Technology
  • 3 - DDR3
  • 4 - DDR4
29 = Speed
  • 13 - 1333
  • 16 - 1600
  • 18 - 1866
  • 21 - 2133
  • 24 - 2400
  • 26 - 2666
  • 28 - 2800
  • 29 - 2933
  • 30 - 3000
  • 32 - 3200
  • 33 - 3333
  • 34 - 3466
  • 36 - 3600
  • 37 - 3733
  • 40 - 4000
  • 41 - 4133
  • 42 - 4266
  • 46 - 4600
  • 48 - 4800
  • 50 - 5000
  • 51 - 5133
  • 53 - 5333
C = DIMM Type
  • C - UDIMM
  • S - SODIMM
15 = CAS Latency
  • 9 - CL9
  • 10 - CL10
  • 11 - CL11
  • 12 - CL12
  • 13 - CL13
  • 14 - CL14
  • 15 - CL15
  • 16 - CL16
  • 17 - CL17
  • 18 - CL18
  • 19 - CL19
  • 20 - CL20
P = Series
  • F - FURY
  • B - Beast
  • S - Savage
  • P - Predator
  • I - Impact
B = Heat Spreader
  • Blank - Blue
  • B - Black
  • R - Red
  • W - White
3 = Revision
  • 2 - 2nd Revision
  • 3 - 3rd Revision
  • 4 - 4th Revision
A = RGB
  • Blank - Non-RGB
  • A - RGB
K4 = Kit + no. in kit
  • Blank – Single module
  • K2 - Kit of 2 modules
  • K4 - Kit of 4 modules
  • K8 - Kit of 8 modules
32 = Total Capacity
  • 4 - 4GB
  • 8 - 8GB
  • 16 - 16GB
  • 32 - 32GB
  • 64 - 64GB
  • 128 - 128GB
  • 256 - 256GB

DDR4 Server Premier

(PC4-2400, PC4-2666, PC4-2933, PC4-3200)

Part Number: KSM26RD4L/32HAI

  • KSM
  • 26
  • R
  • D
  • 4
  • L
  • /
  • 32
  • H
  • A
  • I
KSM = Kingston Server Premier
  • KSM - Kingston Server Premier
26 = Speed
  • 24 = 2400
  • 26 = 2666
  • 29 = 2933
  • 32 = 3200
R = Module Type
  • E is Unbuffered DIMM (ECC)
  • R is Registered DIMM
  • L is Load Reduced DIMM
  • SE is Unbuffered SODIMM (ECC)
D = Ranks
  • S is Single
  • D is Dual
  • Q is Quad
4 = DRAM Type
  • 4 = x4
  • 8 = x8
L = PCB Profile
  • L - Very Low Profile DIMM
32 = Capacity
  • 8GB
  • 16GB
  • 32GB
  • 64GB
  • 128GB
  • 256GB
H = DRAM Manufacturer
  • H = SK Hynix
  • M = Micron
A = DRAM Die Revision
  • A Die
  • B Die
  • E Die
I = Register Manufacturer
  • I = IDT
  • M = Montage
  • R = Rambus

DDR4 ValueRAM

(PC4-2133, PC4-2400, PC4-2666, PC4-2933, PC4-3200)

Part Number: KVR21LR15D8LK2/4HBI

  • KVR
  • 21
  • L
  • R
  • 15
  • D
  • 8
  • L
  • K2
  • /
  • 4
  • H
  • B
  • I
KVR = Kingston ValueRAM
  • KVR - Kingston ValueRAM
21 = Speed
  • 21 – 2133
  • 24 – 2400
  • 26 – 2666
  • 29 – 2933
  • 32 – 3200
L = Low Voltage
  • blank – 1.2V
  • L – TBD
R = Module Type
  • E: Unbuffered DIMM (ECC) w/Thermal Sensor
  • L: Load-Reduced DIMM (LRDIMM)
  • N: Unbuffered DIMM (non-ECC)
  • R: Registered DIMM with Address/Command Parity Function w/Thermal Sensor
  • S: SO-DIMM, Unbuffered (Non-Ecc)
15 = CAS Latency
  • 15 = CAS Latency
D = Ranks
  • S – Single Rank
  • D – Dual Rank
  • Q – Quad Rank
  • O – Octal Rank
8 = DRAM Type
  • 4 – x4 DRAM chip
  • 8 – x8 DRAM chip
  • 6 – x16 DRAM chip
L = Profile
  • blank: any height
  • H – 31.25mm
  • L – 18.75mm (VLP)
K2 = Kit + Number of pieces
  • Blank – Single Module
  • K2 – Kit of Two Modules
  • K3 – Kit of Three Modules
4 = Capacity
  • 4 - Capacity
H = DRAM MFGR
  • H – SK Hynix
  • K – Kingston
  • M – Micron
  • S – Samsung
B = Revision
  • B – Revision
I = Intel Certified
  • I – Intel Certified

DDR3

(PC3-8500, PC3-10600, PC3-12800)

How to Read ValueRAM Part Numbers

Example:
New Part Schema: KVR 16 R11 D4 / 8
Previous Part Schema: KVR 1600 D3 D4 R11 S / 8G

New Part Schema applicable to parts released after May 1, 2012.

Part Number: KVR16LR11D8LK2/4HB

  • KVR
  • 16
  • L
  • R
  • 11
  • D
  • 8
  • L
  • K2
  • /
  • 4
  • H
  • B
KVR = Kingston ValueRAM
  • KVR - Kingston ValueRAM
16 = Speed
  • 16 – 1600
  • 13 – 1333
  • 10 – 1066
L = Low Voltage
  • blank - 1.5V
  • L - 1.35V
  • U - 1.25V
R = Module Type
  • E – Unbuffered DIMM (ECC)
  • N – Unbuffered DIMM (non-ECC)
  • R – Registered DIMM
  • L – Load-Reduced DIMM
  • S – SO-DIMM
11 = CAS Latency
  • 11 – CAS Latency
D = Ranks
  • S – Single Rank
  • D – Dual Rank
  • Q – Quad Rank
8 = DRAM Type
  • 4 – x4 DRAM chip
  • 8 – x8 DRAM chip
L = Profile
  • L – 18.75mm (VLP)
  • H – 30mm
K2 = Kit + Number of pieces
  • K2 – Kit of Two Modules
  • K3 – Kit of Three Modules
  • K4 – Kit of Four Modules
4 = Capacity
  • 4 - 4GB
  • 8 - 8GB
  • 12 - 12GB
  • 16 - 16GB
  • 24 - 24GB
  • 32 - 32GB
  • 48 - 48GB
  • 64 - 64GB
H = DRAM MFGR/Certification
  • H – Hynix
  • E – Elpida
  • I – Intel Validated
B = Die Revision
  • B – Die Revision

DDR3 & DDR2

DDR3 (PC3-8500, PC3-10600) & DDR2 (PC2-3200, PC2-4200, PC2-5300, PC2-6400)

Part Number: KVR1066D3LD8R7SLK2/4GHB

  • KVR
  • 1066
  • D3
  • L
  • D
  • 8
  • R
  • 7
  • S
  • L
  • K2
  • /
  • 4G
  • H
  • B
KVR = Kingston ValueRAM
  • KVR - Kingston ValueRAM
1066 = Speed
  • 1066 - Speed
D3 = Technology
  • D2 - DDR2
  • D3 - DDR3
L = Low Voltage
  • blank - 1.5V
  • L - 1.35V
  • U - 1.25V
D = Ranks
  • S – Single Rank
  • D - Dual Rank
  • Q - Quad Rank
8 = DRAM
  • 4 - x4 DRAM chip
  • 8 - x8 DRAM chip
R = Module Type
  • P - Parity on Register (for registered modules only)
  • E - Unbuffered DIMM (ECC)
  • F - FB DIMM
  • M - Mini-DIMM
  • N - Unbuffered DIMM (non-ECC)
  • R - Registered DIMM with Address/Command Parity Function
  • S - SO-DIMM
  • U - Micro-DIMM
7 = CAS Latency
  • 7 - CAS Latency
S = Thermal Sensor
  • blank – Without Thermal Sensor
  • S – With Thermal Sensor
L = Profile
  • blank – Any height
  • L – 18.75mm (VLP)
  • H – 30mm
K2 = Kit + Number of pieces
  • blank – Single Module
  • K2 – Kit of Two Modules
  • K3 – Kit of Three Modules
4G = Capacity
  • 4G - Capacity
H = DRAM MFGR
  • H: DRAM MFGR
B = Revision
  • B - Revision

DDR

(PC2100, PC2700, PC3200)

Part Number: KVR400X72RC3AK2/1G

  • KVR
  • 400
  • X72
  • R
  • C3
  • A
  • K2
  • /
  • 1G
KVR = Kingston ValueRAM
  • KVR - Kingston ValueRAM
400 = Speed
  • 266
  • 333
  • 400
X72 = X72 ECC
  • X72 = X72 ECC
R = Registered
  • R - Registered
C3 = CAS Latency
  • C3 - CAS Latency
A = DDR400 3-3-3
  • A - DDR400 3-3-3
K2 = Kit + Number of pieces
  • K2 – Kit of Two Modules
1G = Capacity
  • 1G - Capacity

Glossary

Capacity

Total number of available data memory cells on a module expressed in Gigabytes (GB). For kits, the listed capacity is the combined capacity of all modules in the kit.

CAS Latency

A standard predetermined number of clock cycles for data reads/writes to or from the memory modules and the memory controller. Once the data read/write command and the row/column addresses are loaded, CAS Latency represents the wait time until the data is ready.

DDR4

DDR (Double Data Rate) Synchronous Dynamic Random Access Memory (SDRAM) fourth-generation memory technology, more commonly referred to as “DDR4.” DDR4 memory modules are not backward compatible with any previous generations of DDR SDRAM due to lower voltage (1.2V), different pin configurations, and incompatible memory chip technology.

DDR5

DDR (Double Data Rate) Synchronous Dynamic Random Access Memory (SDRAM) fifth-generation memory technology, more commonly referred to as “DDR5.” DDR5 memory modules are not backward compatible with any previous generations of DDR SDRAM due to lower voltage (1.1V), different pin configurations and incompatible memory chip technology.

DIMM Type

UDIMM (non-ECC Unbuffered Dual In-Line Memory Module) is a long form-factor memory module with a data width of x64 most commonly used in desktop systems where error correction is not required and DIMM capacity is restricted.

SODIMM (Small Outline Dual In-Line Memory Module) is a reduced form-factor memory module intended for smaller compute systems such as laptops, micro servers, printers or routers.

Gigabit (Gb)

A bit is the smallest data unit in computing and is represented as a 1 or 0 (on/off). A Gigabit (Gb) is 1 billion bits (or 109) as defined in the International System of Units (SI). For computer memory, Gb (or Gbit) is commonly used to express the density of a single DRAM component.

Gigabyte (GB)

A byte is comprised of 8 bits. A Gigabyte (GB) is 1 billion bytes (or 109) as defined in the International System of Units (SI). For computer memory, GB is used to represent the total data capacity of a memory module, or group of memory modules combined to equal total system memory.

Kit

A part number that includes multiple memory modules typically in support of dual, triple, or quad channel memory architecture. For example, K2 = 2 DIMMs in the package to equal the total capacity.

Speed (a.k.a. Frequency)

The data rate or effective clock speed that a memory module supports measured in MHz (MegaHertz) or MT/s (Megatransfers per second). The higher the speed, the more data can be transferred per second.

Latency Timing

The information below will help illustrate the various settings that can be adjusted when setting the memory timings in the motherboard BIOS for optimum performance. Please note that these settings may vary depending on motherboard make/model or BIOS firmware version.

Sample

15
CL
-
17
tRCD
-
17
tRP/tRCP
-
20
tRA/tRD/tRAS

CAS Latency (CL): Delay between activation of a row and the reading of that row.

RAS to CAS or RAS to Column Delay (tRCD): Activates the row

Row Precharge Delay or RAS Precharge Delay (tRP/tRCP): Deactivates the row

Row Active Delay or RAS Active Delay or time to ready (tRA/tRD/tRAS): Number of clock cycles between activation/deactivation of row.

Disclaimer: All Kingston products are tested to meet our published specifications. Some systems or motherboard configurations may not operate at the published Kingston memory speeds and timing settings. Kingston does not recommend that users attempt to run their computers faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.

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