original mind

KitMill CIP 100We will introduce a method of fabricating a double-sided board by overlapping single-sided boards processed with.
Blow-through through holeTo make the pattern of the part surface and the solder surface conductive, thereby forming a double-sided board.

Normally, double-sided boards are manufactured by processing the board on both sides. Pins are often used for positioning when turning over.
The method of this time has the following merit compared with the conventional method.

• Since it is not turned upside down, there is no worry that the board position will be shifted
• There is no worry that the machining machine will interfere with parts for alignment such as pins
• Even if processing fails, there is no need to rebuild both sides

Two-sided machining requires different know-how from single-sided machining.
If this method is used, it can be processed with the same feeling as a single-sided board, so it can be manufactured easily.
This method is recommended when making double-sided board with KitMill CIP 100.

Design

This time, 0.8 mm thickSingle sided raw substrateAnd in the hammering through holeHT-1-2was used.
Since HT - 1 - 2 has a mounting hole diameter Φ 1.3 mm and head diameter Φ 2 mm, the land of the installation part must be Φ 2 mm or more in diameter Φ 1. 3 mm as shown below.

It is a board designed as follows.
The red pattern is the component side, the blue pattern is the solder side.
The yellow frame is the part that uses the through hole, and the light blue frame is the part that solders also from the parts side.
It is designed not to use the through hole in the hole where the parts that can be soldered from both sides such as resistance are entered.

Board Specification

• Minimum pattern width: 0.41 mm
• Minimum pattern spacing: 0.32 mm
• Minimum hole diameter: Φ0.81 mm
• Substrate size: 76 × 76 mm

Substrate processing

First, I will create an NC program.
It is necessary to create an NC program for component surface and solder surface.

This time,Tosa Masanori FT(Step 1) after processing the pattern withTosa Masanori VC, Process pattern, hole, and external form (step 2).
By doing this, the width of the groove to be processed can be increased, which makes it easier to solder.
Tosa Masanori To process the pattern again at VC is to process a narrow part that could not be processed by Tosa Masanori FT.

To create an NC programORIMIN PCBwas used.
In order to manufacture a double-sided board, it is necessary to invert the solder side without inverting the part side, and convert it.

We will process it using the created NC program.

After machining, remove the board and deburr with a sponge abrasive (fine) while flushing with water.
It finished cleanly.
With KitMill CIP 100, this board can be easily processed.

▲ part surface		▲ Solder surface

Bolted through hole installation

As shown in the picture below, stack the board so that the copper foil face is on the outside.

Insert the through hole through the mounting hole and caulk.
To hammer through through hole, hit it with a hammer as shown below. Be careful as the copper foil of the pattern breaks if too much force is applied.
If the mounting hole is displaced and can not be inserted, it is necessary to adjust the right angle so that the XY axis of the processing machine becomes as much as possible 90 °.

▲ part surface		▲ Solder surface

Solder the bayonet through hole to ensure conduction.

▲ part surface		▲ Solder surface

Electronic component mounting

Solder the electronic components.
As soldering is done also from the component side, pay attention to the order of soldering.

Operation check

I tried to actually operate.

I moved safely. That's it.