home  >  products  >  processors  >  c3-m  >  specs    Print pagePrint page E-mail pageE-mail page

VIA Processors

» Home

VIA C3-M

» Home
» Specifications
» Press Release

Simply Mobile

» Weightless Mobility
» Wireless Mobility
» Non-Stop Mobility
» Entertaining Mobility
» Secure Mobility

Download Center

» Product Brochure
» Image Kit

VIA PadLock Security
Engine

» Home

Initiatives by VIA

» VIA PadLock Security
» Green Computing
» Quiet Computing

VIA C3-M - The Best Processor for Slim and Light Notebook PC Systems

Based on the advanced VIA CoolStream™ architecture, the VIA C3®-M processor is designed to use less power and require less cooling and space than other mobile processors, enabling slim and light mobile system designs with extended battery life.

VIA PowerSaver™ 3.0 technology helps to further reduce power consumption, providing greater mobility with fewer recharging stops.

The VIA C3-M is compatible with Microsoft® Windows® XP/2K/ME and a variety of Linux-based operating systems and has been optimized for the most popular mainstream applications through performance enhancing technologies such as StepAhead™ Advanced Branch Prediction, providing all the digital media and general productivity performance required by the office, home and school mobile system user.

Wireless networks add tremendous value and freedom to mobile system users on the go and are becoming increasingly ubiquitous and accessible. VIA C3-M devices are equipped with ample expandability options to facilitate wireless¹ connectivity with minimal extra cost. Further enhancing the mobile experience and peace of mind, the VIA C3-M processor is equipped with the VIA PadLock Hardware Security Suite, the first ever on-die hardware Random Number Generator (RNG)², that can be used for data encryption and other system/networking security applications.

Download the VIA C3-M processor datasheet for more details.


VIA C3-M Processor Specifications

VIA C3-M Processor
Features
Benefits
Highly efficient CoolStream architecture Increased performance and decreased power consumption
Ultra low power consumption Industry leading power efficiency for maximum battery life
Ultra low heat Low heat, so less active cooling is required. Ideal for light, low profile and quiet notebook designs
VIA Padlock Hardware Security Suite Power efficient industrial strength encryption/decryption and random number generation
PowerSaver 3.0 Helps extend battery life by dynamically altering the processor voltage and clock frequency
Clock speeds of 1.4GHz and beyond Superior digital media and productivity application performance
16 Pipeline Stages Faster CPU speed and efficiency
StepAhead Advanced Branch Prediction Looks ahead and gathers the data needed to optimally run applications
Efficiency enhanced 64KB Full-Speed Exclusive L2 cache with 16-way associativity Greater memory optimization for enhanced digital media streaming and overall performance
SSE Instructions Enhanced 3D and multimedia performance
Full Speed FPU Additional processing power for 3D graphics, multimedia, and streaming functions
Full x86 Operating System & software application compatibility Leverages the richest and most cost-effective software development platforms, including Microsoft® Windows® and Linux
EBGA package Lower profile, higher speed, greater efficiency, better heat dissipation, requires less system real estate
Industry leading 0.13 micron manufacturing process Minimizes power consumption and heat generation while allowing smaller, lighter processor coolers and maximizing total system power efficiency

¹ VIA C3-M systems can be Wi-Fi enabled through a number of options such as internal wireless modules or external PCMCIA and USB 2.0 ports, allowing the user to connect via best of breed 802.11b, 802.11a or 802.11g wireless standards. Additional hardware and software may have to be purchased separately when not bundled with VIA C3-M mobile Personal Electronics devices.

² Elements of the VIA PadLock Security Engine have been evaluated by various leading information security specialists. View the evaluation reports here.


Contact Us

Click here for more information


  Home  »  Trademark Information   »  Feedback   »  Sitemap Copyright©2010 VIA Technologies, Inc.